Multi-Layer Flexible Wearable Circuit Architecture

The patent transitions from planar 2D circuit layouts to a 3D multi-layer architecture with conductive traces distributed across multiple stacked layers. This dimensional expansion allows circuits to achieve flexibility and stretchability while maintaining computational capabilities, as the three-dimensional arrangement enables the circuit to conform to curved and flexible substrates without compromising electrical connectivity

The patent implements a nested multi-layer structure where conductive traces, dielectric layers, and additional conductive layers are stacked and integrated vertically. Each layer is nested within the overall structure, with lower layers providing foundational circuits and upper layers adding additional functionality. This nesting approach enables the circuit to achieve both flexibility and enhanced computational capabilities by combining multiple functional layers in a compact vertical arrangement

The patent utilizes vertical stacking of multiple conductive and dielectric layers to create a three-dimensional circuit architecture. This dimensional transition from 2D to 3D allows the circuit to pack more functional elements into a smaller horizontal footprint, enabling reduced overall circuit volume while maintaining or enhancing computational and functional capabilities through the additional vertical space

The patent employs nested multi-layer construction where conductive traces, dielectric materials, and additional conductive layers are integrated in a vertical stack. This nesting enables multiple functional circuits to be embedded within each other across different layers, maximizing the use of available space and allowing complex functional capabilities to be achieved within a compact volume suitable for wearable applications

The patent distributes conductive traces across multiple vertical layers rather than relying on single-plane traces. This three-dimensional arrangement provides redundant electrical pathways and allows the circuit to maintain connectivity during stretching, as deformation in one layer can be compensated by adjacent layers, thereby preserving electrical integrity while enabling stretchability and comfort

The patent implements nested conductive traces within multiple dielectric layers, creating a stacked configuration where conductive elements are protected and supported by surrounding dielectric materials. This nested structure maintains electrical integrity during stretching by providing mechanical support and continuous conductive pathways across layers, ensuring reliable electrical connection even when the circuit is deformed