Flexible Wire Element Assembly for Microelectronic Chip Integration

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Solution Overview

Problem

Existing methods for connecting microelectronic chip elements to electrically conducting wire elements are unsuitable for flexible structures due to the use of rigid mechanical supports, which complicates integration and handling.

Innovation Solution

A method involving a transfer system to stretch and fix electrically conducting wire elements to chip elements with accessible connection terminals, followed by the application of an electrically insulating material to form a cover, facilitating the formation of a daisy chain while ensuring secure electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a rigid mechanical support is used to connect chip elements, then the connection stability is improved, but the adaptability to flexible structures deteriorates

Engineering Contradiction:

Improveconnection stabilityVSAvoidadaptability to flexible structures

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The patent replaces rigid mechanical supports with flexible wire elements that can be bent and shaped to conform to flexible substrates. The wire element serves as both the mechanical support and the electrical connection medium, eliminating the need for rigid structures while maintaining connection stability through controlled tension and positioning mechanisms.

Inventive Principle:

Principle #30Flexible shells and thin films

2Reliability

If chip elements are connected on a rigid support, then the electrical connection reliability is improved, but the ease of integration into flexible structures deteriorates

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidease of integration into flexible structures

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts the electrical connection function from the rigid support structure and transfers it to the flexible wire element itself. The wire element is directly connected to the chip elements without requiring a rigid substrate, thereby achieving both reliable electrical connections and ease of integration into flexible structures.

Inventive Principle:

Principle #2Taking out (Extraction)

3Manufacturing precision

If a transfer system with tensioning device is used to stretch the wire element, then the positioning precision of chip elements is improved, but the device complexity increases

Engineering Contradiction:

Improvepositioning precision of chip elementsVSAvoiddevice complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies preliminary tensioning to the wire element before chip element placement to establish a stable, precisely positioned baseline. By pre-stretching the wire element to the desired tension and position, subsequent chip element placement becomes simpler and more accurate, reducing the complexity of the overall positioning system.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the cost-effective fabrication of flexible daisy chains with improved handling and protection of chip elements, reducing the risk of short-circuiting and enhancing the structural integrity of the assembly.

Implementation Method 1

stretching of the wire element between the supply device and the storage device by a tensioning device

Methodology Applied

Scientific EffectTension: Tension

Implementation Method 2

addition of an electrically insulating material on the chip element after the latter has been fixed to the wire element to form a cover

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS9953953B2Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

Publication Date: 2018.04.24 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

AI summary

Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.