Flexible Wiring Board Concavity for Display Panel Shape Stability
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Solution Overview
Problem
In display devices, the resilience of flexible wiring boards due to bending causes reliability issues in maintaining the shape and can lead to separation between the lighting unit and the display panel, resulting in non-uniform illumination and degradation in display quality, especially in devices with narrow frames.
Innovation Solution
A display device design featuring a flexible wiring board with a concavity on its second surface between the IC chip and terminal, which reduces the thickness and improves flexibility, allowing stable bending and maintaining the bent state, thereby preventing separation between the lighting unit and the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flexible wiring board with predetermined thickness is used to ensure reliable connection to IC chips, then connection reliability is improved, but the wiring board cannot maintain its bent shape due to resilience
Solution Approach 1:
The patent applies local quality by creating a concave portion only in the specific region where the wiring board contacts the housing, while maintaining the original thickness in other areas. This localized thinning reduces resilience at the contact point without compromising the overall structural integrity and connection reliability of the wiring board.
Solution Approach 2:
The patent changes the thickness parameter of the wiring board locally by forming a concave portion. This parameter change reduces the thickness from the predetermined thickness to a reduced thickness in the concave region, thereby reducing resilience and enabling the wiring board to maintain its bent shape while preserving connection reliability in other areas.
2Length of moving object
If the wiring board is bent to narrow the frame, then frame width is reduced, but separation between lighting unit and display panel occurs due to resilience
Solution Approach 1:
The patent applies local quality by creating a concave portion only in the specific region where the wiring board contacts the housing, while maintaining the original thickness in other areas. This localized thinning reduces resilience at the contact point without compromising the overall structural integrity and connection reliability of the wiring board.
Solution Approach 2:
The patent changes the thickness parameter of the wiring board locally by forming a concave portion. This parameter change reduces the thickness from the predetermined thickness to a reduced thickness in the concave region, thereby reducing resilience and enabling the wiring board to maintain its bent shape without causing separation, thus preserving connection stability.
Data Source
AI summary
A display device is provided and includes a display panel; and a wiring board comprising a flexible base, a terminal electrically connected to the display panel, wherein the flexible base including a first surface, a second surface on an opposite side to the first surface, and a concavity in the second surface, the wiring board is mounted on the display panel and is bent so that the wiring board is opposed to a rear surface side of the display panel, and the concavity is provided in the portion of the wiring board which is bent.