Flexible Wiring Substrate for Wearable Sensor Module
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Solution Overview
Problem
Existing sensor modules for vital sign monitoring, such as pulse oximeters, cannot mount electronic components like light emitting and receiving elements and control circuits on a single flexible wiring substrate for comfortable wear on a fingertip.
Innovation Solution
A sensor module with a flexible wiring substrate that alternates component mounting and non-mounting regions, allowing for the integration of electronic components like CPUs, LEDs, and photodiodes, which are mounted on a ring-shaped member to facilitate comfortable fingertip wear and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are mounted on a single wiring substrate for fingertip wear, then device integration and comfort are improved, but the substrate becomes rigid and inflexible
Solution Approach 1:
The wiring substrate is divided into component mounting regions and component non-mounting regions. The component non-mounting regions are designed to be flexible and can be curved along the outer circumferential direction of the ring-shaped member, while the component mounting regions provide stable mounting positions for electronic components. This segmentation allows different parts of the substrate to have different functional properties.
Solution Approach 2:
Different regions of the wiring substrate are assigned different qualities: the component mounting regions have rigid characteristics to support electronic components, while the component non-mounting regions have flexible characteristics to allow bending and conforming to the finger shape. This local differentiation resolves the contradiction between overall flexibility and local stability.
2Volume of moving object
If electronic components are integrated on a single substrate, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The substrate is segmented into regions with different functions: component mounting regions where electronic components are mounted, and component non-mounting regions where no components are placed. This segmentation simplifies the manufacturing process by allowing standardized mounting patterns in specific regions while leaving other regions clear for flexibility.
Solution Approach 2:
The wiring substrate serves multiple functions: it provides mechanical support for electronic components in the mounting regions, maintains electrical connections through its wiring structure, and provides flexibility through the non-mounting regions. This multi-functionality reduces the need for additional structural elements, thereby miniaturizing the device.
3Ease of operation
If the wiring substrate is made flexible for comfortable wear, then wearability is improved, but structural stability for mounting components deteriorates
Solution Approach 1:
The substrate is divided into component mounting regions that provide structural stability for mounting electronic components, and component non-mounting regions that provide flexibility for comfortable wear. The alternating arrangement in the longitudinal direction ensures that rigid and flexible properties are distributed appropriately throughout the device.
Solution Approach 2:
The component non-mounting regions are curved along the outer circumferential direction of the ring-shaped member, allowing the substrate to conform to the cylindrical shape of the finger. This curvature design enhances flexibility and comfort while the component mounting regions maintain sufficient structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of a compact, wearable sensor module that can accurately measure vital signs like oxygen saturation with improved comfort and reduced size, allowing for wireless communication without the need for extensive wiring.
Implementation Method 1
a probe provided with a light emitting element and a light receiving element is worn on a finger of an examinee to project light toward the finger
Implementation Method 2
measure a change of a light quantity of the light via the finger so that a temporal change of blood oxygen saturation can be obtained
Data Source
AI summary
A sensor module includes a ring-shaped member; and a semiconductor device that is provided on the ring-shaped member. The semiconductor device includes: a wiring substrate that has flexibility; and electronic components that are mounted on the wiring substrate. The wiring substrate has component mounting regions, wherein at least one electronic component is mounted in each of the component mounting regions, and component non-mounting regions, wherein no electronic component is mounted in each of the component non-mounting regions. The component mounting regions and the component non-mounting regions are provided alternately in a longitudinal direction of the wiring substrate. The component non-mounting regions are curved along an outer circumferential direction of the ring-shaped member.