Flexible Wiring Substrate Stiffness Reduction in Imaging Modules

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Solution Overview

Problem

High pixel density in imaging modules requires precise positioning of lens and imaging element units, but existing flexible substrates face increased stiffness and cost issues when trying to adjust inclination, affecting imaging quality and reliability.

Innovation Solution

An imaging module design featuring a lens unit with multiple driving mechanisms and a flexible wiring substrate with a bent or curved shape to reduce stiffness, allowing for precise positioning and inclination adjustment of the imaging element unit relative to the lens unit, using a manufacturing method that involves imaging a measurement chart to adjust and fix the units.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a flexible substrate is used to connect the lens unit and imaging element unit, then positioning accuracy and inclination adjustment capability are improved, but substrate stiffness increases due to multiple terminals for AF mechanism and optical type image blur correction mechanism

Engineering Contradiction:
Improvepositioning accuracyVSAvoidsubstrate stiffness
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The flexible substrate is divided into multiple regions with different terminal arrangements. The terminals are segmented into groups that serve different functions (AF mechanism, optical type image blur correction mechanism), allowing the substrate to maintain flexibility while providing sufficient connection points for multiple mechanisms.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The terminal arrangement on the flexible substrate utilizes two-dimensional spatial optimization. Terminals are distributed across the substrate surface in a pattern that minimizes stiffness while ensuring electrical connectivity for all required mechanisms, transforming a one-dimensional constraint into a two-dimensional solution.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If the number of terminals on the flexible substrate increases to support AF mechanism and optical type image blur correction mechanism, then functional capability is improved, but substrate stiffness and manufacturing cost increase

Engineering Contradiction:
Improvefunctional capabilityVSAvoidmanufacturing cost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The flexible substrate is designed as a universal platform that can accommodate multiple different mechanisms (AF mechanism, optical type image blur correction mechanism) through a standardized terminal arrangement pattern. This multi-functional design allows the same substrate structure to serve multiple purposes without requiring separate specialized substrates for each mechanism.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The terminal arrangement parameters on the flexible substrate are optimized to balance the number of terminals with substrate flexibility. By adjusting terminal density, distribution pattern, and connection trace routing, the design achieves sufficient functionality for multiple mechanisms while maintaining manufacturing feasibility and cost-effectiveness.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS10015401B2Imaging module, manufacturing method of imaging module, and electronic device
Publication Date: 2018.07.03 FUJIFILM CORP
  • US10015401B2 patent drawing
  • US10015401B2 patent drawing
  • US10015401B2 patent drawing

AI summary

An imaging module 100 includes a lens unit 10 which has a lens group 12, and an imaging element unit 20 which is fixed to the lens unit 10 and has an imaging element 27 which images a subject through the lens group 12. The lens unit 10 has a lens drive unit 16, and a flexible substrate 13A which includes a wiring group 13a which is electrically connected to the lens drive unit 16. The imaging element unit 20 has a wiring connection portion 24 which is electrically connected to the wiring group 13a included in the flexible substrate 13A. The flexible substrate 13A is folded in the middle of the flexible substrate 13A.