Flexible X-ray Sensor with Adhesive Bonded Scintillator
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Solution Overview
Problem
Conventional X-ray sensors, particularly indirect conversion types, are inflexible due to their fixed shape, limiting their ability to accommodate various shapes and curvatures of examination targets, and suffer from dielectric breakdown and low reliability issues.
Innovation Solution
An X-ray sensor design featuring a thin, flexible array substrate with a semiconductor layer and a scintillator panel bonded using adhesive layers, allowing for curvature and enhanced reliability through the use of flexible polymer layers to minimize fatigue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a hard substrate is used to form array elements such as light-receiving elements and transistors, then structural stability and manufacturing precision are improved, but flexibility and adaptability to various shapes are worsened
Solution Approach 1:
The patent replaces the traditional hard substrate with a flexible substrate that can be bent or curved. The array elements (light-receiving elements, transistors, etc.) are formed directly on this flexible substrate, allowing the entire sensor assembly to adapt to various shapes and curvatures while maintaining structural integrity and manufacturing precision through standardized fabrication processes.
2Adaptability or versatility
If the semiconductor substrate is made thin to achieve flexibility, then adaptability to various shapes is improved, but mechanical strength and reliability are worsened
Solution Approach 1:
The patent employs a composite structure consisting of multiple layers including the flexible substrate, semiconductor layer, light-receiving elements, transistors, and protective coatings. This composite design distributes mechanical stresses across different materials with complementary properties, providing both the necessary flexibility for bending and sufficient mechanical strength for reliable operation.
3Productivity
If direct conversion X-ray sensor is used, then conversion efficiency is improved, but dielectric breakdown and reliability are worsened due to high voltage operation
Solution Approach 1:
The patent introduces an indirect conversion mechanism where X-rays first convert to visible light in a scintillator layer, which then converts to electrical signals in photodiodes. This intermediary light conversion step eliminates the need for high-voltage operation in the direct conversion path, thereby preventing dielectric breakdown while maintaining effective X-ray to signal conversion through the two-stage process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexible X-ray sensor effectively addresses the limitations of conventional sensors by enabling imaging of targets with diverse shapes and curvatures while reducing physical fatigue and improving reliability.
Implementation Method 1
a scintillator panel bonded to the array substrate and including a scintillator layer
Implementation Method 2
a semiconductor layer having a light-receiving element
Data Source
AI summary
This invention relates to an X-ray sensor having flexible properties and to a method of manufacturing the same. This X-ray sensor includes an array substrate including a semiconductor layer having a light-receiving element; a scintillator panel bonded to the array substrate and including a scintillator layer; a first polymer layer attached to an outer surface of the array substrate by a first adhesive layer; a second polymer layer attached to an outer surface of the scintillator panel by a second adhesive layer; and a third adhesive layer disposed between the array substrate and the scintillator panel so as to attach the array substrate and the scintillator panel to each other.