Flex-less Multilayer Ceramic Substrate for High-Bandwidth Optoelectronics

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Solution Overview

Problem

Conventional flex-based optoelectronic assemblies face limitations in data transmission bandwidth and reliability due to physical constraints and heat management issues, leading to bottlenecks in computer systems and fiber optic networks.

Innovation Solution

A flex-less optoelectronic assembly utilizing a multilayer ceramic substrate with conductive vias for signal transmission and integrated heat dissipation, eliminating the need for flex components and enhancing thermal management by using a heat sink integrated into the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If flex components are used for signal transmission, then ease of connection is improved, but reliability and bandwidth are worsened due to physical constraints and heat management issues

Engineering Contradiction:

Improveease of connectionVSAvoidsignal transmission reliability

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The patent removes flex components from the optoelectronic assembly, extracting the problematic element that caused reliability and bandwidth limitations. The rigid multilayer ceramic substrate replaces the flex component, eliminating physical constraints and heat management issues while maintaining connection functionality through integrated conductive vias and mount points.

Inventive Principle:

Principle #2Taking out (Extraction)

2Adaptability or versatility

If flex components are used for signal transmission, then adaptability is improved, but bandwidth and data transmission speed are worsened due to physical constraints

Engineering Contradiction:

Improveconnection adaptabilityVSAvoiddata transmission bandwidth

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent replaces the mechanical flex component system with a rigid multilayer ceramic substrate system. This substitution eliminates the physical constraints of flex components while providing integrated conductive vias and mount points that enable higher bandwidth and faster data transmission, achieving both adaptability and improved productivity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If conventional substrates are used, then manufacturing simplicity is maintained, but heat dissipation capability is worsened leading to thermal stress

Engineering Contradiction:

Improvesubstrate manufacturing simplicityVSAvoidheat dissipation capability

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent employs a multilayer ceramic substrate composed of multiple ceramic layers with integrated conductive vias. This composite structure provides superior heat dissipation capability compared to conventional substrates while maintaining manufacturing feasibility through established ceramic layering and via formation processes, thereby reducing thermal stress.

Inventive Principle:

Principle #40Composite materials

4Temperature

If multilayer ceramic substrate with integrated heat sink is used, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsubstrate structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges the substrate and heat sink into a single integrated multilayer ceramic substrate structure. The multiple ceramic layers themselves provide thermal management pathways, and conductive vias extend through the layers to facilitate heat dissipation. This integration improves heat dissipation efficiency while avoiding the complexity of separate substrate and heat sink components.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables higher-speed signal transmission and improved reliability by avoiding flex interconnects, reducing thermal stress, and effectively dissipating heat, thereby overcoming bandwidth limitations and reliability issues in computer systems and fiber optic networks.

Implementation Method 1

The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate

Methodology Applied

Scientific EffectHeat dissipation: Conduction (thermal)

Data Source

PatentUS9900974B2Flex-less multilayer ceramic substrate

Publication Date: 2018.02.20 II VI DELAWARE INC

AI summary

In one example embodiment, an optoelectronic assembly includes a multilayer ceramic substrate that includes multiple ceramic layers and a via disposed through at least one of the ceramic layers. The via may be formed from a conductive material that is configured to communicate a signal through the via. The multilayer ceramic substrate may be configured to dissipate heat emitted by an electronic component coupled to the multilayer ceramic substrate.