Flexure-Based Cooling Structure for Multi-Chip Package Stress Mitigation
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Solution Overview
Problem
Assembly processes for multi-chip microelectronic package structures introduce non-uniform stresses, leading to substantial yield loss due to detrimental stress introduction, which existing technologies fail to effectively mitigate.
Innovation Solution
The implementation of flexure-based cooling structures that decouple assembly loads from the die and the rest of the cooling structure through flexure beam structures, redistributing stress and minimizing load transfer to the die, thereby preventing damage and improving assembly process margins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If assembly processes are used to form multi-chip microelectronic package structures, then the package structure can be assembled with multiple components, but non-uniform stresses are introduced into the die causing substantial yield loss
Solution Approach 1:
The cooling structure is divided into multiple sections with flexure beam structures connecting them, allowing each section to move independently and distribute stresses rather than transmitting them uniformly to the die
Solution Approach 2:
Flexure beam structures serve as intermediary elements between the cooling structure sections and the die, absorbing and redistributing mechanical stresses before they reach the die, thereby protecting the die from stress-induced damage
2Temperature
If rigid cooling structures are used to maintain thermal performance, then thermal conductivity is improved, but mechanical stresses are transmitted directly to the die causing damage
Solution Approach 1:
The cooling structure transitions from a rigid static design to a dynamic flexible design where flexure beams allow controlled movement and deformation, enabling the structure to adapt to thermal expansion and mechanical loads without transmitting damaging stresses to the die
Solution Approach 2:
Flexure beam structures with controlled flexibility are introduced into the cooling structure, allowing it to maintain thermal contact with the die while mechanically isolating the die from stress through elastic deformation of the flexible beams
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flexure-based cooling structures effectively reduce die damage by decoupling thermal and mechanical loads, enhancing reliability and process margins, and maintaining thermal performance without impacting the die's integrity.
Implementation Method 1
the at least one flexure beam structure decouples a load strain from the first portion and the second portion
Data Source
AI summary
Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.