Flexure Ejector Pin Mechanism for Continuous Micro-LED Die Transfer
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Solution Overview
Problem
Current technologies face challenges in achieving high-speed, high-precision, and high-efficiency transfer of Mini/Micro-LED dies due to limitations in precision and efficiency, particularly in mass production, where existing Pick & Place modes struggle with micron-scale die sizes and require high production costs.
Innovation Solution
A compliant mechanical system utilizing a flexure-based continuous ejector pin mechanism with voice coil motors and flexible hinges allows for continuous and precise horizontal and vertical motion of a pricking pin, enabling efficient transfer of Mini/Micro-LED dies by converting intermittent motion into uniform motion, thereby improving transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional Pick & Place mode is used for die transfer, then the transfer process can be implemented, but the transfer speed is too slow and cannot meet ultra-high speed requirements for Mini/Micro-LED production
Solution Approach 1:
The patent replaces the conventional mechanical nozzle-based Pick & Place system with a thimble-based pricked crystal transfer system. The thimble directly contacts and transports the LED die without requiring nozzle aperture constraints, enabling ultra-high speed transfer. The thimble is driven by a voice coil motor that can rapidly accelerate and decelerate, achieving transfer speeds exceeding 10,000 dies per hour while maintaining positioning precision through electromagnetic control.
Solution Approach 2:
The patent implements continuous motion of the motion platform throughout the transfer process, eliminating intermittent stopping and starting. The thimble maintains continuous contact with the die during transport, and the platform moves continuously at constant speed while the thimble performs pickup and placement operations. This continuous action removes motion inertia effects and enables sustained ultra-high speed production without compromising precision.
2Manufacturing precision
If the motion platform moves intermittently to position dies, then positioning can be achieved, but transfer precision deteriorates and efficiency is limited
Solution Approach 1:
The patent replaces the intermittent motion control system with a continuous motion platform combined with a precisely controlled thimble mechanism. The thimble, driven by a voice coil motor, achieves precise positioning and release of dies while the platform moves continuously. The voice coil motor's electromagnetic control provides precise position control without requiring the platform to stop, maintaining both precision and continuous high-speed operation.
Solution Approach 2:
The patent employs dynamic control where the thimble accelerates and decelerates rapidly under voice coil motor control to pick up and place dies during the platform's continuous motion. The system dynamically adjusts the thimble's vertical motion while maintaining constant horizontal platform speed, enabling precise die placement without interrupting the continuous workflow and maintaining ultra-high transfer efficiency.
3Ease of operation
If a thimble reciprocates vertically to push dies onto the substrate, then die transfer can be achieved, but the intermittent motion affects both precision and efficiency
Solution Approach 1:
The patent maintains the vertical reciprocating motion of the thimble for die pickup and placement operations but eliminates the intermittent motion of the platform. The thimble performs its vertical action cycles while the platform moves continuously at constant speed, ensuring the useful action of die transfer continues without interruption. This separation of functions allows the thimble to complete its operation while maintaining continuous forward motion, achieving both ease of operation and ultra-high efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enhances transfer efficiency and precision by allowing continuous thorn die attach operations, maintaining horizontal motion speed with the motion platform, and ensuring precise placement of LED dies without damaging them during the transfer process.
Implementation Method 1
A compliant mechanical system utilizing a flexure-based continuous ejector pin mechanism with voice coil motors
Implementation Method 2
flexure-based continuous ejector pin mechanism with flexible hinges allows for continuous and precise horizontal and vertical motion
Data Source
AI summary
A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexible hinges, and a pricking pin. The first thorn die attach drive devices and the second thorn die attach drive devices are mounted on the drive support plate. A drive end of the first thorn die attach drive device horizontally passes rightward through the first flexible hinge at a corresponding position; a drive end of the second thorn die attach drive device horizontally passes leftward through the first flexible hinge at a corresponding position; and the mounting base is hinged to the drive ends of the two thorn die attach drive devices through the second flexible hinges.