Flexure Ejector Pin Mechanism for Continuous Micro-LED Transfer
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Solution Overview
Problem
Current Mini/Micro-LED chip transfer and packaging technologies face challenges in achieving high accuracy, efficiency, and cost-effectiveness due to the miniaturization of chip sizes, requiring precise and efficient transfer methods that are often hindered by high equipment costs, vibration, and reduced precision in existing laser, vacuum nozzle, and mechanical thorn die attach methods.
Innovation Solution
A flexure-based continuous ejector pin mechanism with a thorn die attach unit, utilizing voice coil motors and flexible hinges made of aviation aluminum, allows for precise and efficient transfer of Mini/Micro-LED dies by enabling continuous, non-intermittent motion of the pricking pin for accurate and rapid attachment to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser transfer method is used, then die detachment and transfer can be achieved, but equipment cost and operational complexity increase significantly
Solution Approach 1:
The patent replaces the laser-based detachment system with a mechanical pricking pin system. The pricking pin physically pierces the carrier substrate to release individual dies, eliminating the need for laser equipment, special nitrogen-generating materials, and complex laser control systems while achieving precise die transfer
Solution Approach 2:
The patent uses a simple, inexpensive pricking pin that can be easily replaced or reset, replacing expensive laser equipment and special carrier materials. The pin performs its function of detaching dies and can be reused or replaced without significant cost
2Manufacturing precision
If vacuum nozzle method is used, then die suction and transfer are possible, but transfer efficiency decreases due to sequential operation
Solution Approach 1:
The patent enables continuous operation by allowing the motion platform to move continuously while the pricking pin operates. Multiple dies can be transferred in sequence without stopping the platform, and the pin can be reset quickly for the next die without interrupting the overall transfer process
Solution Approach 2:
The patent uses a flexible hinge mechanism that allows the pricking pin to dynamically adjust its position and angle. The pin can flexibly reach different dies on the carrier substrate and return to its initial position smoothly, enabling continuous operation without rigid mechanical constraints
3Manufacturing precision
If mechanical thorn die attach method with intermittent motion is used, then die pricking can be achieved, but transfer speed is limited by frequent start-stop operations
Solution Approach 1:
The patent allows the motion platform to move continuously at constant speed while the pricking pin operates independently. The die attachment and pin reset operations occur without stopping the platform, eliminating the start-stop cycle and significantly increasing transfer speed while maintaining precision through coordinated control
4Productivity
If conventional mechanical thorn die attach device is used, then die transfer is possible, but vibration reduces packaging precision
Solution Approach 1:
The patent uses a flexible hinge mechanism made of thin, flexible material that allows the pricking pin to move smoothly without generating vibration. The flexible hinge absorbs mechanical shocks and eliminates the vibration problems associated with rigid mechanical structures, maintaining packaging precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances transfer efficiency and precision, reduces costs, and improves yield by enabling high-speed, accurate attachment of Mini/Micro-LED dies with lower equipment costs and reduced vibration, compared to existing methods.
Implementation Method 1
both the first drive frame and the second drive frame are of rectangular frame structures
Implementation Method 2
utilizing voice coil motors and flexible hinges made of aviation aluminum
Data Source
AI summary
A flexure-based continuous ejector pin mechanism for Mini/Micro chip mass transfer includes a first drive frame, a second drive frame, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin. The second drive frame and the first drive frame are connected through the first flexible hinge. The mounting base is connected to a left side and a right side of the second drive frame through the second flexible hinges. Compared with a laser transfer technology, the flexible movable thorn die attach device has lower cost and higher accuracy; compared with a vacuum nozzle transfer technology, the flexible movable thorn die attach device has higher transfer efficiency and quality; and compared with a conventional thorn die attach device, the flexible movable thorn die attach device has higher transfer efficiency and precision.