Flip-Chip Bonding Alignment Protrusions for High-Density Chip Placement
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Solution Overview
Problem
The flip-chip bonding manufacturing process faces challenges in achieving high alignment accuracy, particularly for chips with a high number of pins or high-density arrangements, which affects product yield and the efficiency of signal transmission.
Innovation Solution
A chip bonding apparatus equipped with a pick and place module and an alignment module, featuring alignment protrusions that extend towards sockets on the redistribution structure, enhances alignment accuracy through precise positioning and optical sensing, ensuring correct chip placement and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional optical alignment using fiducial marks is used for flip-chip bonding, then the alignment process is simple, but the alignment accuracy is insufficient for high-density chips
Solution Approach 1:
The patent introduces alignment protrusions and alignment sockets as intermediary structures that physically mediate the alignment between chip and substrate. These protrusions extend from the substrate toward sockets, creating a mechanical guidance system that works in conjunction with optical fiducial marks to achieve high-precision alignment for high-density chip configurations
Solution Approach 2:
The alignment protrusions are pre-formed on the substrate before chip placement. These protrusions extend toward the sockets in advance, creating a prepared alignment pathway that guides the chip into correct position during bonding, thereby improving alignment accuracy before the actual bonding operation occurs
2Measurement precision
If alignment protrusions are added to enhance alignment accuracy, then positioning precision improves, but the device structure becomes more complex
Solution Approach 1:
The alignment protrusions serve multiple functions: they act as mechanical guides for alignment, provide structural support during bonding, and work in conjunction with optical fiducial marks. This multi-functionality reduces the need for separate alignment mechanisms, thereby limiting the increase in overall device complexity while achieving improved positioning accuracy
Data Source
AI summary
A chip bonding apparatus for bonding a chip and a redistribution structure with each other is provided. The chip bonding apparatus includes a pick and place module and an alignment module. The pick and place module is suitable for picking up and placing the chip. The alignment module is movably connected to the pick and place module. The alignment module includes at least one alignment protrusion, wherein the at least one alignment protrusion extends toward at least one alignment socket included in the redistribution structure. Furthermore, a chip bonding method and a chip package structure are provided.