Thin Flip Chip Package With Aperture Heat Dissipation Paste
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Solution Overview
Problem
Conventional thin flip chip package structures face challenges in heat dissipation due to the need for a dam to prevent sealing resin from polluting the heat dissipation paste, which complicates chip-substrate connection and increases processing time and costs.
Innovation Solution
A substrate with apertures on its bottom surface, where the heat dissipation paste fills and contacts the lateral and base surfaces of these apertures, enhancing coupling strength and eliminating the need for a dam by allowing the sealing resin to be contained between the chip and insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dam is formed on the substrate to block sealing resin, then the heat dissipation paste is protected from pollution, but the chip connection to substrate becomes difficult and processing complexity increases
Solution Approach 1:
The patent extracts and eliminates the dam structure from the package design. Instead of adding a blocking structure, the invention uses the natural configuration of the insulating layer with recessed regions to contain the sealing resin, thereby removing the unnecessary dam component that complicated the chip connection process.
Solution Approach 2:
Instead of using a protruding dam to block the sealing resin, the patent inverts the approach by creating recessed regions in the insulating layer that naturally contain the sealing resin. This inversion eliminates the need for a separate blocking structure and simplifies the overall package design.
2Reliability
If a dam is formed on the substrate to block sealing resin, then the heat dissipation paste is protected from pollution, but processing time and costs increase
Solution Approach 1:
The patent removes the dam formation step from the manufacturing process entirely. By designing the insulating layer with integrated recessed regions that naturally contain the sealing resin, the process eliminates the additional processing steps required to form and apply a separate dam structure, thereby reducing processing time and costs.
3Reliability
If the dam height is increased to block sealing resin, then pollution prevention is improved, but chip-substrate connection difficulty increases
Solution Approach 1:
Instead of increasing the height of a protruding dam to contain the sealing resin, the patent inverts the approach by creating recessed regions in the insulating layer. This inversion provides effective sealing resin containment while maintaining a flat or lowered profile that does not interfere with chip-substrate connection operations.
4Device complexity
If no dam is formed, then processing is simplified, but sealing resin flows into through hole polluting heat dissipation paste
Solution Approach 1:
The patent performs preliminary action by pre-forming recessed regions in the insulating layer before applying the sealing resin. These pre-prepared recessed areas naturally guide and contain the sealing resin, preventing it from flowing into the through hole and polluting the heat dissipation paste, thereby eliminating the need for a separate dam structure.
Solution Approach 2:
The insulating layer is designed to serve multiple functions: it provides electrical insulation, structural support, and sealing resin containment through its recessed regions. This multi-functionality eliminates the need for a separate dam structure, simplifying the overall package design while maintaining heat dissipation paste purity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency, reduces processing time, and lowers costs by increasing the contact area between the heat dissipation paste and the insulating layer, while eliminating the need for a dam, thus simplifying the manufacturing process.
Implementation Method 1
The heat dissipation paste at least fills the apertures and contacts the base surface of each of the apertures... the lateral wall and the bottom surface of each of the apertures are in contact with the heat dissipation paste for raising the contact area between the heat dissipation paste and the insulating layer
Data Source
AI summary
A thin flip chip package structure comprises a substrate, a chip and a heat dissipation paste, the substrate comprises an insulating layer and a trace layer. The insulating layer comprises a top surface, a bottom surface and a plurality of apertures formed at the bottom surface, wherein the bottom surface of the insulating layer comprises a disposing area and a non-disposing area. Each of the apertures is located at the disposing area and comprises a lateral wall and a base surface. A first thickness is formed between the base surface and the insulating layer, a second thickness is formed between the top surface and the bottom surface, and the second thickness is larger than the first thickness. The chip disposed on the top surface comprises a chip surface and a plurality of bumps. The heat dissipation paste at least fills the apertures and contacts the base surface.