Flip Chip Bump Arrangement for Non-Uniform Power Domains

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional flip chip schemes using regular inline-bumps or stagger-bumps are unable to fit non-uniform power domains, resulting in worse IR drops and limitations in signal routing and bump placement.

Innovation Solution

A flip chip scheme and method that arrange bumps in non-uniform patterns, specifically using equilateral triangles and squares, to form non-uniform power domains and bump maps, allowing for maximum bump placement and improved signal routing by deleting or shifting bumps as needed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If regular inline-bumps or stagger-bumps are used, then the manufacturing process is simple, but the power domains cannot be fitted properly resulting in worse IR drops

Engineering Contradiction:

Improvebump arrangement simplicityVSAvoidIR drop performance

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies local quality by using different bump patterns (inline-bump, stagger-bump, centered-bump) in different regions corresponding to different power domain requirements. Each power domain is fitted with the most appropriate bump pattern locally, allowing optimization of IR drop performance for each specific region while maintaining overall manufacturing feasibility.

Inventive Principle:

Principle #3Local quality

2Reliability

If non-uniform bump patterns are used to fit power domains, then IR drops are reduced, but the manufacturing complexity increases

Engineering Contradiction:

ImproveIR drop performanceVSAvoidbump arrangement complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent segments the chip into multiple power domains, each with its own optimized bump pattern. This segmentation allows each region to be manufactured independently with its specific pattern requirements, reducing the overall complexity compared to creating a completely custom non-uniform pattern across the entire chip.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If bumps are arranged in fixed patterns, then the manufacturing process is straightforward, but signal routing flexibility is limited

Engineering Contradiction:

Improvebump placement simplicityVSAvoidsignal routing flexibility

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent introduces dynamic bump placement by allowing bumps to be shifted from their standard positions within each power domain. This dynamic adjustment capability enables flexible signal routing while maintaining the structured approach of using defined bump patterns, thus balancing manufacturing simplicity with routing adaptability.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS20160190083A1Flip chip scheme and method of forming flip chip scheme

Publication Date: 2016.06.30 HAMILCAR BARCA IP LLC

AI summary

The present invention provides a flip chip scheme and a method of forming the flip chip scheme. The flip chip scheme comprises: a plurality of bumps, some of the bumps arranged in a first pattern, respectively, and some of the bumps arranged in a second pattern different from the first pattern, respectively; wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps. The method comprises: arranging some of the bumps in a first pattern, respectively, and arranging some of the bumps in a second pattern different from the first pattern, respectively; wherein the first pattern is an equilateral triangle arranged by three bumps, and the second pattern is a square arranged by four bumps.