Flip-Chip Connector Structure for Discharge-Stable Chip Packaging

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Solution Overview

Problem

Chip-on-film products using double-sided traces experience unstable electrical properties and progressive, unpredictable G-bright line defects, affecting the stability of electronic products and limiting their application.

Innovation Solution

A flip-chip and chip packaging structure are designed with conductive connectors that include a conductive bump connected to the package surface and a conductive extension portion on the side of the bump away from the driver chip, increasing the gap between the driver chip and the wiring substrate to prevent discharge and improve stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the gap between the driver chip and the wiring substrate is reduced, then the integration density is improved, but the risk of discharge and short circuits increases

Engineering Contradiction:

Improveintegration densityVSAvoidrisk of discharge and short circuits

Core Design Contradiction:

Area of moving objectVSReliability

Solution Approach 1:

The conductive extension portion serves as an intermediary element between the conductive bump and the wiring substrate. It extends the conductive connection while maintaining an appropriate gap, preventing direct contact that could cause short circuits while ensuring electrical connectivity through the extension portion

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive extension portion changes the dimensional arrangement by extending in a direction away from the driver chip, creating a three-dimensional conductive path that allows the gap to be reduced in the vertical direction while maintaining safety margins through lateral extension

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If the conductive connector size is increased, then the electrical connection reliability is improved, but the available area for other components is reduced

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidavailable area for other components

Core Design Contradiction:

ReliabilityVSArea of moving object

Solution Approach 1:

The conductive connector is segmented into two distinct parts: the conductive bump that provides the primary electrical connection, and the conductive extension portion that ensures reliable connectivity while occupying minimal space. This segmentation allows each part to be optimized for its specific function

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If the melting point of the conductive extension portion is reduced, then the manufacturing process flexibility is improved, but the thermal stability is reduced

Engineering Contradiction:

Improvemanufacturing process flexibilityVSAvoidthermal stability

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

Different parts of the conductive connector have different material properties: the conductive bump uses a material with appropriate melting point for bonding, while the conductive extension portion uses a material with lower melting point to facilitate manufacturing processes such as reflow soldering without damaging other components

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12293962B2Flip chip and chip packaging structure

Publication Date: 2025.05.06 CHENGDU BOE OPTOELECTRONICS TECH CO LTD

AI summary

The present disclosure relates to a flip-chip and a chip packaging structure. The flip-chip includes: a driver chip having a package surface facing a wiring substrate; and a plurality of conductive connectors. Any one of the plurality of conductive connectors includes a conductive bump connected to the package surface and a conductive extension portion on a side of the conductive bump away from the driver chip.