Flip Chip EMI Shielding with Exposed Die Backside
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges with electromagnetic interference (EMI) shielding, as current methods often compromise thermal dissipation and package profile, failing to meet modern consumer demands.
Innovation Solution
The development of a semiconductor package with EMI shielding formed over an exposed die backside, utilizing a conductive shielding layer that contacts the semiconductor die and substrate, allowing for improved heat dissipation while maintaining a low profile, and incorporating multiple shielding layers and materials like stainless steel and copper for effective interference protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conductive shielding layers are formed over semiconductor packages to shield from EMI, then electromagnetic interference protection is improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The shielding structure is segmented into multiple functional layers: a first conductive shielding layer contacts the backside of the semiconductor die for EMI protection, while a second conductive shielding layer is positioned at the bottom of the package cavity. This segmentation allows different portions of the shielding system to serve different functions - one layer prioritizes EMI shielding while the other facilitates thermal management, resolving the contradiction between shielding effectiveness and thermal dissipation.
2Object-affected harmful factors
If traditional EMI shielding methods are used, then interference protection is improved, but package profile height increases
Solution Approach 1:
The shielding approach transitions from vertical stacking (increasing package height) to utilizing the backside surface area of the semiconductor die. The first conductive shielding layer is formed directly on the backside of the die, and the second layer is positioned at the bottom of the package cavity, effectively using the horizontal plane and existing package structure to achieve shielding without increasing the vertical profile dimension.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively shields semiconductor devices from EMI, enhances thermal dissipation, and maintains a low profile, addressing the limitations of prior art methods by providing reliable operation and reduced interference in electronic systems.
Implementation Method 1
Conductive layers are commonly formed over semiconductor packages to shield electronic parts within the package from EMI and other interference. Shielding layers absorb EMI before the signals can hit semiconductor die and discrete components within the package
Implementation Method 2
allowing for improved heat dissipation while maintaining a low profile
Data Source
AI summary
A semiconductor device has a substrate and a semiconductor die disposed over the substrate. An encapsulant is deposited over the semiconductor die and substrate with a surface of the semiconductor die exposed from the encapsulant. A first shielding layer is formed over the semiconductor die. In some embodiments, the first shielding layer includes a stainless steel layer in contact with the surface of the semiconductor die and a copper layer formed over the stainless steel layer. The first shielding layer may further include a protective layer formed over the copper layer. One embodiment has a heatsink bonded to the semiconductor die through a solder layer. A second shielding layer can be formed over a side surface of the semiconductor die.