Flip Chip Package with Exposed Clip for Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic circuits face reduced efficiency and degraded operation due to parasitic inductance, especially at high frequencies, and thermal limitations of conventional device packages hinder power density and heat dissipation, with existing packaging solutions lacking effective top-side cooling and backside die grounding.
Innovation Solution
A packaged electronic device with an inverted die and a conductive clip attached to a multilayer substrate, providing direct electrical connections and top-side cooling, along with a package structure that encloses the semiconductor die and a portion of the conductive clip, facilitating heat dissipation and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonded packages with lead frames are used, then electrical connections are established, but parasitic inductance increases and thermal dissipation capability deteriorates
Solution Approach 1:
The patent removes the traditional lead frame structure from the package, extracting the source of high parasitic inductance. Instead of using wire bonds connected to lead frames, the invention directly connects the die to the PCB through solder bumps, eliminating the inductive path created by lead frames and wire bonds.
Solution Approach 2:
The patent transitions from a planar connection architecture to a three-dimensional stacked architecture. The die is positioned above the PCB with vertical connections through solder bumps, enabling direct electrical connection in the Z-dimension and allowing heat to dissipate vertically through the die to the PCB, thus solving both electrical performance and thermal management issues simultaneously.
2Temperature
If conventional packages with bottom side cooling only are used, then device structure is simple, but thermal dissipation capability and power density are limited
Solution Approach 1:
The patent adds vertical thermal management capability by positioning the die above the PCB and establishing thermal conduction path in the Z-dimension. Heat flows directly from the die backside through the solder bumps to the PCB, creating an additional thermal dissipation dimension beyond traditional bottom-side cooling, thereby enabling higher power density without significantly increasing package complexity.
3Temperature
If lidded embedded die packages are used, then thermal dissipation is improved, but top side ground connection is not provided
Solution Approach 1:
The patent removes the lid structure from the package design, eliminating the barrier that prevented top-side ground connection. By opening the package structure, the die backside becomes accessible for direct ground connection to the PCB through the solder bumps, simultaneously providing both thermal dissipation and electrical grounding functions.
Solution Approach 2:
The solder bumps in the patent serve dual functions: establishing electrical connection and providing thermal conduction path. The same structural element (solder bump) that connects the die to the PCB electrically also conducts heat from the die to the PCB, thereby achieving multi-functionality without requiring separate components for electrical and thermal management.
4Reliability
If direct plated copper layers on embedded dies with redistribution layer are used, then electrical performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent uses standard commercial off-the-shelf (COTS) die with pre-formed solder bumps instead of custom-designed embedded dies requiring expensive redistribution layers. The approach leverages readily available components and standard packaging processes, significantly reducing manufacturing cost while maintaining good electrical performance through direct die-to-PCB connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution offers cost-effective, efficient heat dissipation and electrical performance with reduced parasitic inductance, enabling higher power density and frequency operation, while avoiding the limitations of wire bonded packages and embedded die packaging.
Implementation Method 1
The clip is directly connected to one of the first conductive structures of the first layer... providing top-side cooling... facilitating heat dissipation
Implementation Method 2
The conductive clip directly connected to one of the first conductive structures of the first layer... providing backside die grounding... reduced parasitic inductance
Implementation Method 3
The conductive clip is soldered to one of the first conductive structures of the first layer
Data Source
AI summary
A packaged electronic device includes a multilayer substrate, including a first side, a first layer having a first plurality of conductive structures along the first side, and a second layer having a second plurality of conductive structures, a semiconductor die soldered to a first set of the conductive structures, a conductive clip directly connected to one of the conductive structures of the first layer and to a second side of the semiconductor die, and a package structure that encloses the semiconductor die and a portion of the conductive clip.