Flip-Chip Semiconductor Package With Exposed Heat Dissipating Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices with flip-chip mounted semiconductor elements experience lower heat dissipation due to the lower thermal conductivity of sealing resin compared to die pads, leading to increased thermal resistance and reduced heat dissipation efficiency.
Innovation Solution
A semiconductor device configuration that includes a heat dissipating layer bonded to the semiconductor elements via a solid-phase diffusion bonding layer and an intermediate layer, with the heat dissipating layer's design optimizing thermal conductivity and reducing thermal resistance, allowing for improved heat dissipation without enlarging the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip-chip mounting is used to reduce parasitic inductance, then electrical connection performance is improved, but heat dissipation deteriorates due to lower thermal conductivity of sealing resin compared to die pad
Solution Approach 1:
A heat dissipating layer is introduced as an intermediary component between the semiconductor element and the sealing resin. This layer has higher thermal conductivity than the sealing resin, serving as a thermal bridge to conduct heat away from the semiconductor element more effectively, thus resolving the heat dissipation deterioration caused by flip-chip mounting.
Solution Approach 2:
The patent employs composite material structure by combining the heat dissipating layer with the sealing resin. The heat dissipating layer is made of material with superior thermal conductivity properties, creating a composite thermal management system that overcomes the limitations of pure sealing resin material.
2Temperature
If heat dissipating layer is added to improve heat dissipation, then thermal management is improved, but device complexity increases
Solution Approach 1:
The heat dissipating layer is designed to serve multiple functions: it acts as a thermal conduction path, provides mechanical support, and can serve as an electrical isolation layer. By making the component multi-functional, the patent reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The heat dissipating layer is integrated into the existing package structure, merging thermal management functionality with the封装 structure. Rather than adding a completely separate heat sink component, the heat dissipating layer is combined with the sealing resin and substrate structure, reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration enhances heat dissipation by reducing thermal resistance and facilitating quicker heat conduction from the semiconductor elements to the heat dissipating layer, thereby improving the overall thermal management of the semiconductor device.
Implementation Method 1
heat generated by the semiconductor element is conducted to the sealing resin that covers the semiconductor element. The thermal conductivity of the sealing resin is generally lower than that of the die pad
Implementation Method 2
a heat dissipating layer bonded to the first obverse surface via a solid-phase diffusion bonding layer
Data Source
AI summary
A semiconductor device includes a first semiconductor element, a sealing resin, and a heat dissipating layer. The first semiconductor element includes a first obverse surface that faces in a first direction, and a first electrode and a second electrode that are located on a side opposite the first obverse surface in the first direction. The sealing resin covers the first semiconductor element. The heat dissipating layer is bonded to the first obverse surface. The heat dissipating layer includes a heat dissipating surface facing a same side as the first obverse surface in the first direction. The heat dissipating surface is exposed from the sealing resin to the outside. As viewed in the first direction, the peripheral edge of the heat dissipating surface surrounds the first obverse surface.