Flip-Chip Assembly Using Preformed Insulating Tape
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Solution Overview
Problem
Existing electronic device connection methods, such as bonding wires and flip chip technology, face inefficiencies and complexities, particularly in making through-holes for multi-terminal chips, leading to increased production time and risk of chip damage.
Innovation Solution
The use of preformed insulating tapes with through-holes allows for direct electrical contact to chip terminals and the base plate from a single side, eliminating the need for etching and reducing production time by using pre-perforated tapes to create contacts, enhancing mechanical stability and alignment efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If through-holes are made in several phases by etching, then terminals are exposed, but production time increases and chip damage risk increases
Solution Approach 1:
The insulating layer is provided with through-holes before the chip is mounted onto the base plate. This preliminary formation of through-holes eliminates the need for subsequent etching operations after chip mounting, thereby reducing production time and avoiding chip damage risks associated with multi-phase etching processes.
Solution Approach 2:
The insulating layer is separated into multiple layers (first insulating layer and second insulating layer) with through-holes formed in each layer at different stages. This segmentation allows for precise control of through-hole formation while simplifying the overall process by distributing the hole-making operations across separate, manageable steps.
2Manufacturing precision
If through-holes are made in several phases, then different depth requirements are met, but process complexity increases
Solution Approach 1:
The insulating structure is divided into multiple insulating layers, each requiring through-holes of different depths. By segmenting the insulating layer, the complex task of creating through-holes of varying depths in a single thick layer is broken down into simpler, sequential operations on thinner individual layers.
Solution Approach 2:
Through-holes for different depths are prepared in advance in separate insulating layers before chip assembly. This preliminary preparation of through-holes with different depths in segmented layers simplifies the overall process by avoiding complex multi-phase etching operations that would be required if all through-holes were created after chip mounting.
3Volume of moving object
If chips are mounted upside down for flip chip connection, then device size is reduced, but terminal accessibility becomes problematic
Solution Approach 1:
The solution moves the terminal accessibility problem from the horizontal plane to the vertical dimension by forming through-holes that pass through the insulating layer perpendicular to the chip surface. This allows terminals to be accessed from the front surface of the chip even when mounted upside down in flip chip configuration, maintaining small device size while solving the accessibility issue.
Data Source
AI summary
A method for making a set of electronic devices is proposed. The method comprises the steps of providing a support comprising a base plate of electrically conductive material, fixing a set of chips of semiconductor material onto respective portions of the base plate, each chip having a first main surface with at least one first conduction terminal and a second main surface opposite the first main surface with at least one second conduction terminal electrically connected to the base plate, fixing an insulating tape of electrically insulating material comprising a plurality of through-holes to the main surface of each chip, the insulating tape protruding from the chips over a further portion of the base plate being not covered by the chips, and forming at least one first electrical contact to each first terminal of the chips through a first set of the through-holes exposing at least in part said first terminal, and at least one second electrical contact to the base plate through a second set of the through-holes exposing at least in part the further portion of the base plate.