Flip Chip Package Leadframe for Mechanical Stability and Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Flip chip semiconductor packages face challenges in achieving both mechanical stability and efficient heat dissipation, particularly in compact and power-efficient designs for mobile and wearable electronics.

Innovation Solution

The semiconductor package incorporates a flip chip surrounded by a thermally conductive leadframe and encapsulated with a mold compound, where the leadframe serves as a heat dissipation structure and enhances mechanical stability, with contacts protruding from the encapsulant to facilitate thermal connection and electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a flip chip package is designed to be compact for mobile and wearable electronics, then the package size is reduced, but mechanical stability deteriorates

Engineering Contradiction:

Improvepackage sizeVSAvoidmechanical stability

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent employs a composite structure combining flip chip, leadframe, and encapsulant materials with different mechanical properties. The leadframe provides rigid structural support while the encapsulant offers flexibility and protection, creating a composite package that maintains mechanical stability despite reduced overall size.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The package is segmented into distinct functional components: the flip chip for electronic functionality, the leadframe for mechanical support and electrical connection, and the encapsulant for protection. This segmentation allows each component to be optimized independently, with the leadframe specifically designed to provide structural stability in compact form factors.

Inventive Principle:

Principle #1Segmentation

2Temperature

If heat dissipation structures are added to maintain operating temperature ranges, then heat dissipation performance is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The leadframe is designed to serve multiple functions simultaneously: it provides mechanical support for the flip chip, establishes electrical connections through leadframe contacts, and acts as a heat dissipation structure. This multi-functionality eliminates the need for separate heat dissipation components, maintaining temperature control without increasing device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the heat dissipation function with the existing leadframe structure. Rather than adding separate heat sinks or thermal management components, the leadframe itself is configured to conduct heat away from the flip chip, combining structural and thermal management functions into a single integrated component.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves mechanical stability and heat dissipation performance, enabling the package to withstand processing and handling while maintaining operating temperature ranges effectively.

Implementation Method 1

The leadframe serves as a heat dissipation structure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The encapsulant encapsulates the leadframe and the flip chip

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20220270942A1Flip chip semiconductor package with a leadframe to enhance package mechanical stability and heat dissipation

Publication Date: 2022.08.25 UTAC HEADQUARTERS PTE LTD

AI summary

A flip chip package is disclosed. The package includes a leadframe surrounding a flip chip. The leadframe and flip chip are encapsulated by a mold compound. The leadframe provides package support to enhance the mechanical stability of the package. In some cases, a heat dissipating structure is disposed on top of the package, connecting the flip chip to enhance heat dissipation.