Flip-Chip LED Module with Dielectric Circuit Channels
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Solution Overview
Problem
Conventional micro LED chip mass transfer processes are challenging due to precision difficulties and high equipment costs, especially when miniaturization is involved, leading to low yield rates and prolonged production times.
Innovation Solution
A micro light emitting diode module is created using flip-chip LEDs with a dielectric layer containing electric channels and circuits, eliminating the need for mass transfer to a circuit board by forming electrical connections directly on the LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mass transfer of LED chips to a predetermined circuit board is performed, then electrical connections can be established, but manufacturing precision deteriorates and equipment cost increases
Solution Approach 1:
The patent merges the LED chip array with the circuit board function by forming electrical circuits directly on the LED array substrate. The dielectric layer with embedded electric channels integrates both mechanical support and electrical connection functions into a single component, eliminating the need for separate mass transfer to a predetermined circuit board.
Solution Approach 2:
Instead of transferring LED chips to a predetermined circuit board as in conventional methods, the patent inverts the approach by forming the circuit board structure first with integrated electric channels, then embedding LED chips directly into this pre-formed structure during the same manufacturing process.
2Length of moving object
If LED chips are miniaturized, then display resolution is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent performs preliminary actions by pre-forming the dielectric layer with electric channels and circuit patterns before embedding the miniaturized LED chips. This allows the LED chips to be placed directly into pre-prepared receptacles with precise electrical connections already in place, eliminating the need for high-precision mass transfer operations.
3Reliability
If conventional mass transfer process is used, then electrical connections can be established, but productivity deteriorates due to prolonged production time
Solution Approach 1:
The patent merges multiple sequential processes (circuit board fabrication, LED chip placement, and electrical connection) into a single integrated manufacturing step where LED chips are embedded directly into the dielectric layer with electric channels, achieving both reliable electrical connections and improved productivity.
Data Source
AI summary
A micro light emitting diode module contains: multiple flip-chip LEDs and a dielectric layer. The multiple flip-chip LEDs are arranged side by side. The flip-chip LEDs have a light emitting side and an electrical connecting side. The electrical connecting side of the flip-chip LEDs has a p-contact pad and an n pad. The dielectric layer is formed on the electrical connecting side of the flip-chip LEDs. The dielectric layer has multiple electric channels in which multiple electrical circuits are formed. The electrical circuits are corresponded to the p-contact pads and the n-contact pads of the flip-chip LEDs respectively, and each electrical circuit is electrically connected to its corresponding p-contact pad or n-contact pad. By reconstruction of circuits on LED array, the present invention not only has high processing yield, but also significantly reduces the manufacturing time. A method for making the micro light emitting diode module is also provided.