Flip-Chip LED With Segmented Grooves For Heat Dissipation
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Solution Overview
Problem
Conventional LEDs experience heat accumulation and reduced light emitting efficiency when operated at high current densities due to a small contact area between the n-type electrode and semiconductor layer, which affects current distribution and light emitting area.
Innovation Solution
The LED package features a substrate with a first-type-doped layer, light emitting layer, and second-type-doped layer, along with multiple first grooves and a second groove that expose the first-type-doped layer, increasing the contact area and ensuring uniform current distribution through the use of an insulation layer and strategically placed contacts, allowing for operation at high current densities without heat accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the trench area is made smaller to increase the light emitting area, then the light emitting area increases, but the contact area between the n-type electrode and the n-type semiconductor layer becomes too small causing heat accumulation at high current densities
Solution Approach 1:
The single large trench is segmented into multiple smaller trenches (first trenches and second trenches) that are distributed across the semiconductor layer. This segmentation allows the n-type electrode to make contact with the n-type semiconductor layer at multiple discrete locations, increasing the total contact area for heat dissipation while maintaining a large overall light emitting area. The segmented trench structure resolves the contradiction by providing both sufficient electrical contact and sufficient light emission surface.
Solution Approach 2:
The invention transitions from a single-dimensional (one large trench) to a multi-dimensional (multiple distributed trenches) configuration. By arranging trenches in both first and second directions and creating a grid-like pattern of contact points, the design increases the dimensional complexity of the electrode-semiconductor interface, thereby increasing total contact area without sacrificing light emitting area.
2Temperature
If the trench area is made larger to increase the contact area for heat dissipation, then the contact area increases, but the light emitting area is reduced leading to lower light emitting efficiency
Solution Approach 1:
The trench structure is divided into multiple segments that are strategically positioned to provide heat dissipation pathways without forming a large continuous area that would block light emission. The segmented approach allows heat to be conducted away through multiple narrow channels while leaving the majority of the semiconductor surface available for light generation.
Solution Approach 2:
Different regions of the semiconductor layer are given different functions: areas with trenches provide heat dissipation and electrical contact, while areas between trenches provide light emission. The local quality varies spatially, with trenches concentrated in specific patterns that optimize both thermal management and optical performance simultaneously.
3Temperature
If the contact area between the n-type electrode and the n-type semiconductor layer is increased to reduce heat accumulation, then heat dissipation improves, but the light emitting area is reduced
Solution Approach 1:
The contact area is segmented into multiple discrete contact points formed by individual trenches rather than one large contact area. This allows the total contact area to be increased through multiple small contacts while preserving the light emitting area between these contacts. The n-type electrode makes contact at multiple localized points rather than over a large continuous area.
Solution Approach 2:
The contact structure evolves from a single large contact region to a multi-dimensional array of contact points distributed across the semiconductor surface. By adding spatial distribution in multiple directions (first and second directions), the total contact area increases without requiring a large footprint that would reduce light emitting area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables the LED to maintain high light emitting efficiency and prevent heat accumulation at high current densities by ensuring uniform current distribution and a balanced light emitting area, enhancing its performance and efficiency.
Implementation Method 1
a light emitting layer (122)... The LED (1) emits light through electroluminescence in the light emitting layer (122)
Data Source
AI summary
A light emitting diode (LED) is revealed. The LED includes a substrate, a first-type-doped layer, a light emitting layer, a second-type-doped layer, a plurality of first grooves, a second groove, an insulation layer, a first contact, and a second contact. The LED features that the second groove is connected to one end of each first groove and penetrates the second-type-doped layer and the light emitting layer to expose a part of the first-type-doped layer. The contact area between the first contact and the first-type-doped layer is increased. Therefore, the LED is worked at high current densities without heat accumulation. Moreover, the light emitting area is not reduced and the light emitting efficiency is not affected. The LED is flipped on a package substrate to form a flip-chip LED package.