Flip-Chip Light Emitting Device Package with Integrated Wiring
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Solution Overview
Problem
Conventional display devices with LEDs require additional backlights, making them less compact and less efficient in terms of optical performance compared to LCDs, and they lack the flexibility to alter aspect ratios and scale for large displays.
Innovation Solution
A compact light emitting device package is developed, featuring flip-chip structured light emitting chips with integrated wirings and electrode pads, covered by a translucent molding member that includes a metal layer, colored lower layer, and partition structure, allowing for efficient light emission and easy mounting without the need for a PCB or lead-frame, enabling flexible display configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional display devices use additional backlights, then illumination intensity is improved, but device complexity and volume increase
Solution Approach 1:
The patent combines the backlight unit and display panel into a single integrated structure. The light emitting chips are mounted directly on the lower surface of the molding member, eliminating the need for separate backlight components and reducing overall device complexity while maintaining illumination intensity
Solution Approach 2:
The molding member serves multiple functions: it protects the light emitting chips, provides structural support, and acts as the illumination source itself. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity
2Illumination intensity
If conventional display devices use additional backlights, then illumination intensity is improved, but volume of moving object increases
Solution Approach 1:
By integrating the backlight function into the display panel structure itself, the patent eliminates the need for separate backlight housing and components, significantly reducing the overall volume of the display device while maintaining adequate illumination intensity
Solution Approach 2:
The light emitting chips are nested within the molding member structure, with the wiring embedded in the lower surface. This nested arrangement maximizes space utilization and minimizes the overall volume of the display device
3Illumination intensity
If conventional display devices use additional backlights, then illumination intensity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The wiring is embedded in the lower surface of the molding member during the molding process itself, rather than being added separately afterward. This preliminary action reduces the number of subsequent assembly steps and lowers the precision requirements for later manufacturing operations
Solution Approach 2:
The patent uses a flip-chip mounting technique where the light emitting chips are inverted and mounted directly onto the wiring. This changes the mounting parameters and allows for more tolerant alignment specifications compared to traditional wire-bonding methods, reducing manufacturing precision requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, high-efficiency light emitting device package that can be used in various display formats, offering improved optical performance, reduced crosstalk, and ease of mounting, while eliminating the need for additional backlights, thus enhancing display capabilities.
Implementation Method 1
a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance
Data Source
AI summary
A light emitting device package includes: a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip to form a flip-chip structure; a plurality of wirings directly connected to the electrodes of the chips, respectively; a plurality of electrode pads disposed below the chips and directly connected to the wirings, respectively; and a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and including a translucent material having a predetermined transmittance, wherein the wirings are disposed below a lower surface of the molding member.