Flip-Chip LED Device with Stacked Driver Circuit
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Solution Overview
Problem
Conventional light-emitting diode (LED) devices have a large size due to the placement of light-emitting diode chips and driver circuits on the same plane, which obstructs light emission and deteriorates light mixing quality.
Innovation Solution
The LED device features light-emitting diode chips directly electrically contacted with a driver circuit chip in a flip-chip manner, eliminating the need for bonding wires and allowing the chips to be stacked on the driver circuit, thereby minimizing device size and preventing light obstruction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light-emitting diode chips and driver circuit are disposed on the same plane, then electrical connection is achieved, but device size increases and light emission is blocked
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration. The light-emitting diode chips are positioned on a first substrate while the driver circuit is placed on a second substrate located above the first substrate. This vertical stacking in the third dimension reduces the horizontal footprint and eliminates light obstruction, as the driver circuit no longer blocks the light emission path of the LED chips.
2Ease of manufacture
If bonding wires are used to connect light-emitting diode chips to driver circuit, then electrical connection is established, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent removes the bonding wire connection method entirely from the system. Instead of using separate bonding wires to establish electrical connections between the LED chips and driver circuit, the invention integrates the driver circuit onto a second substrate that is directly coupled to the first substrate containing the LED chips. This extraction of the bonding wire element simplifies the overall structure and manufacturing process.
Solution Approach 2:
The patent merges the electrical connection function with the substrate coupling structure. The second substrate serving as the driver circuit platform is directly coupled to the first substrate, thereby integrating both mechanical support and electrical connection functions into a single structural arrangement, eliminating the need for separate bonding wire components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall size of the LED device and enhances light mixing quality by ensuring unobstructed light emission from the chips.
Implementation Method 1
Light-emitting diodes (LEDs) are made of semiconductor materials and used to convert electrical energy into light energy
Data Source
AI summary
A light-emitting diode device with a driving mechanism is provided. A first light-emitting diode chip, a second light-emitting diode chip and a third light-emitting diode chip are arranged on a driver circuit chip, and respectively configured to emit red light, green light and blue light. A first contact of the light-emitting diode chip, a first contact of the second light-emitting diode chip and a first contact of the third light-emitting diode chip are respectively in direct electrical contact with a first output contact, a second output contact and a third output contact of the driver circuit chip in a flip-chip manner. A second contact of the first light-emitting diode chip, a second contact of the second light-emitting diode chip and a second contact of the third light-emitting diode chip are in direct electrical contact with a common contact of the driver circuit chip.