Flip-Chip LED Package Layout for Centered Light Symmetry
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Solution Overview
Problem
Existing light-emitting diode devices face challenges in symmetry and miniaturization due to the placement of the driving chip and light-emitting diode on the same plane, which limits substrate use space and affects light symmetry, and conventional wire bonding methods require large substrate areas.
Innovation Solution
A light-emitting diode device design featuring a substrate with conductive vias, conductive pads, flat layers, and redistribution layers that allow flip-chip bonding of light-emitting diodes, enabling them to be centered without being covered by circuits, and incorporating reflective layers to enhance light emission efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding technology is used to package the driving chip, then the driving chip can be connected to the substrate, but a large space on the substrate is required which limits the use space of the substrate
Solution Approach 1:
The patent transitions from planar wire bonding to three-dimensional flip-chip bonding with redistribution layers. The driving chip is bonded face-to-face with the substrate through conductive vias and redistribution layers, utilizing vertical space rather than horizontal substrate area, thereby resolving the contradiction between connection ease and substrate space utilization.
2Device complexity
If the driving chip and light-emitting diode are placed on the same plane, then the structure is simplified, but the light-emitting diode cannot be located at the center affecting the symmetry of the light emitted
Solution Approach 1:
The patent employs multi-layer redistribution layers and flat layers to create vertical separation between the driving chip and light-emitting diode. This allows the light-emitting diode to be positioned at the optical center for symmetric light emission while the driving chip resides on a different plane, resolving the contradiction between structural simplicity and light symmetry.
3Shape
If the light-emitting diode is centered for optimal symmetry, then light emission symmetry is improved, but the light-emitting diode may be covered by circuits affecting light emission efficiency
Solution Approach 1:
The patent segments the device into distinct functional layers: the driving chip layer with circuits, the light-emitting diode layer at the optical center, and intermediate flat layers separating them. This segmentation ensures that circuit elements are confined to specific planes and do not obstruct the light emission path of the centered light-emitting diode, simultaneously achieving light symmetry and emission efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves improved symmetry and miniaturization by allowing light-emitting diodes to be centered, maintains light emission efficiency, and reduces the need for high-precision circuits, while enhancing optical performance and ease of assembly.
Implementation Method 1
a red light emitting diode, a green light emitting diode, a blue light emitting diode
Data Source
AI summary
A light emitting diode device includes a substrate, a conductive via, first and second conductive pads, a driving chip, a flat layer, a redistribution layer, a light emitting diode, and an encapsulating layer. The substrate has a first surface and a second surface opposite thereto. The conductive via penetrates from the first surface to the second surface. The first and second conductive pads are respectively disposed on the first and second surface and in contact with the conductive via. The driving chip is disposed on the first surface. The flat layer is disposed over the first surface and covers the driving chip and the first conductive pad. The redistribution layer is disposed on the flat layer and electrically connects to the driving chip. The light emitting diode is flip-chip bonded to the redistribution layer. The encapsulating layer covers the redistribution layer and the light emitting diode.