Flip-Chip LED Light Emitting Unit with Longitudinal Heat Dissipation
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Solution Overview
Problem
Conventional LED packages used in endoscopes suffer from light quantity loss, heat generation issues, and increased diameter due to inefficient heat release, leading to decreased light quality and increased noise in image pickup devices.
Innovation Solution
A light emitting unit with high thermal conductivity and low resistance electrode members, where flip-chip-type LEDs are mounted with their electrodes connected to these members, allowing heat to be released along the longitudinal direction of the electrode members, and multiple units share a common electrode member for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional LED packages are used to obtain large light quantity, then sufficient illumination is achieved, but heat generation increases and package diameter increases
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat dissipation by extending the heat dissipation plate in the thickness direction of the substrate. This vertical extension creates additional heat release pathways without increasing the lateral footprint, allowing high-power LED operation while maintaining a compact package diameter suitable for endoscope constraints.
Solution Approach 2:
The patent introduces a heat dissipation plate as an intermediary thermal management component between the LED chip and the environment. This plate acts as a thermal conductor that efficiently transfers heat away from the LED junction, enabling high light output while controlling temperature rise through enhanced thermal pathways.
2Reliability
If conventional LED packages with wire bonding are used, then electrical connection is achieved, but heat release efficiency decreases
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the conventional LED package structure. By directly mounting the LED chip to the substrate with integrated electrode patterns, the design removes the thermal and mechanical weaknesses of wire bonds while maintaining reliable electrical connection through direct metallurgical bonding, thereby improving heat release efficiency.
Solution Approach 2:
The patent replaces the mechanical wire bonding system with a direct substrate mounting system where LED electrodes are bonded directly to substrate electrode patterns. This substitution eliminates the intermediate wire bonding mechanical connection that impeded heat flow, creating a more thermally efficient pathway from LED to substrate while maintaining electrical functionality.
3Illumination intensity
If light guides are used to guide illuminative light, then subject illumination is achieved, but light quantity is largely lost
Solution Approach 1:
The patent extracts and eliminates the light guide component from the illumination system. By placing LEDs directly at the distal end of the endoscope, the design removes the light guide that caused significant light loss through absorption and scattering, enabling high light quantity to reach the subject without intermediate transmission losses.
Solution Approach 2:
The patent inverts the conventional illumination architecture by placing the light source at the distal end rather than at the proximal end with light guidance. This reversal eliminates the need for light guides and directly delivers maximum light quantity to the subject, transforming the illumination approach from guided transmission to direct emission.
4Length of stationary object
If endoscope distal end diameter is reduced, then miniaturization is achieved, but heat dissipation capability decreases
Solution Approach 1:
The patent resolves the diameter-heat dissipation contradiction by utilizing the thickness direction (z-axis) for heat dissipation rather than relying solely on lateral expansion. The heat dissipation plate extends vertically from the substrate, creating three-dimensional heat release pathways that maintain compact lateral dimensions while providing adequate thermal management capability.
Solution Approach 2:
The patent employs composite material structures in the heat dissipation plate and substrate assembly, combining materials with high thermal conductivity in the heat dissipation pathway while maintaining overall structural compactness. This composite approach enables effective heat dissipation within the constrained distal end diameter through optimized material properties and thermal pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the endoscope's distal end diameter, improves heat release efficiency, prevents light quantity drop, and minimizes temperature rise, ensuring sufficient light while reducing noise and cost by eliminating the need for bonding wires and substrates.
Implementation Method 1
heat generated in the light emitting device is to be released along the longitudinal direction of the electrode member
Data Source
AI summary
A light emitting unit includes at least one electrode member having high thermal conductivity and low resistance, and one or more flip-chip-type light emitting device of which an anode electrode side or a cathode electrode side is connected to the electrode member, and wherein the electrode member extends in a longitudinal direction thereof, and heat generated in the light emitting device is to be released along the longitudinal direction of the electrode member.