Flip-Chip LED Module with Wavelength Conversion Layer
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Solution Overview
Problem
Conventional LED lighting modules suffer from poor optical performance due to large LED distribution, limited light-output angle, high thermal resistance, and increased fabrication costs, resulting in blurring and inefficient light emission.
Innovation Solution
The LED module employs flip-chip packaging with an optical wavelength conversion layer covering multiple light-output surfaces, a light-guide layer, and a substrate with optimized electrode and bonding pad arrangements to enhance light emission and reduce thermal resistance, allowing for adjustable spacing and improved light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional wire bonding packaging is used with large LED distribution, then the LED module can be manufactured with standard processes, but the light diverges and optical performance deteriorates
Solution Approach 1:
The patent inverts the conventional packaging approach by using flip-chip packaging instead of wire bonding. This inversion allows the LED chip to be mounted with its light-emitting surface facing downward toward the substrate, enabling better light extraction and distribution while maintaining manufacturability through standardized flip-chip processes
Solution Approach 2:
The patent transitions from planar LED distribution to a three-dimensional arrangement by utilizing vertical stacking and multi-layer substrate structures. This dimensional change allows for optimized light distribution patterns while maintaining compact module sizes and standard manufacturing capabilities
2Manufacturing precision
If an opaque structure is used to define phosphor coating position, then the phosphor layer can be precisely positioned, but the light-output angle is limited
Solution Approach 1:
The patent extracts and removes the opaque structure from the LED module design. Instead of using an opaque structure to define phosphor positioning, the invention uses a transparent or translucent substrate that allows light to pass through while providing precise phosphor coating positions through patterned surfaces or localized deposition areas
Solution Approach 2:
The patent introduces a light-guide layer as an intermediary between the LED chips and the external environment. This light-guide layer serves as a mediator that both positions the phosphor layers accurately and redirects light to achieve wider output angles, replacing the need for opaque structures
3Reliability
If conventional LED packages with plastic housing are used, then the LED can be protected and mounted, but the thermal resistance is high and optical effect is poor
Solution Approach 1:
The patent employs composite material structures by combining different materials with complementary properties. The LED package uses a combination of thermally conductive materials for heat dissipation, transparent materials for light extraction, and protective coatings for reliability, achieving low thermal resistance while maintaining protection and mounting stability
Solution Approach 2:
The patent segments the LED package into distinct functional layers: a thermal management layer for heat dissipation, an optical layer for light extraction and distribution, and a protective layer for mechanical strength and environmental protection. This segmentation allows each layer to be optimized independently for its specific function
4Reliability
If individual lenses are used for each LED package, then the LED can be protected, but the fabrication cost increases and optical performance deteriorates with blurring
Solution Approach 1:
The patent merges multiple individual lens functions into a single integrated light-guide layer that serves all LED packages simultaneously. This light-guide layer provides both protection and optical direction control for multiple LEDs, reducing fabrication complexity and cost while eliminating the blurring effect caused by multiple separate lenses
Solution Approach 2:
The light-guide layer is designed as a universal component that performs multiple functions: protecting the LED packages, directing light output, positioning phosphor layers, and managing thermal distribution. This multi-functionality replaces the need for individual lenses for each LED, reducing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances illumination efficiency, color uniformity, and light-output angle, reducing thermal resistance and fabrication costs while maintaining high optical performance across various lighting applications.
Implementation Method 1
an optical wavelength conversion layer covering a first light-output surface and a plurality of second light-output surfaces
Data Source
AI summary
A light-emitting diode (LED) module and a lamp using the same are provided. The LED module includes a substrate and several light-emitting packages. Each light-emitting package includes an optical wavelength conversion layer and a light-emitting diode having a first light-output surface, a bonding surface, and several second light-output surfaces. The bonding surface is opposite the first light-output surface and connected to the substrate. The second light-output surfaces are between the first light-output surface and the bonding surface. The optical wavelength conversion layer covers the first and second light-output surfaces. The distance between the bonding surface and the top surface of the optical wavelength conversion layer represents a light source thickness. The distance between two adjacent light-emitting packages represents a spacing of light sources. Specifically, the ratio of the spacing of light sources to the light source thickness is between 1 and 6.3.