Flip-Chip Die Package Metal Rods for EMI Isolation
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Solution Overview
Problem
In flip-chip die packages, the increasing integration of functional circuits leads to significant electromagnetic interference between circuits with radiation and reception capabilities, compromising isolation and reliability due to the formation of resonant cavities between the die, substrate, and conductive bumps.
Innovation Solution
The implementation of a flip-chip die package structure with a first metal structure comprising metal rods arranged around active functional circuits to alter resonance characteristics, combined with an optional filling layer that converts electromagnetic waves into thermal energy, enhances electromagnetic isolation and reduces stress caused by thermal expansion mismatches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flip-chip die package structure is used with conductive bumps connecting the die to the substrate, then electrical connection is achieved, but a resonant cavity is formed between the die, substrate, and conductive bumps causing electromagnetic interference
Solution Approach 1:
The patent extracts the harmful resonant cavity formed by the conductive bumps, die, and substrate by introducing a first metal structure that removes or neutralizes the cavity's electromagnetic resonance, thereby eliminating the interference path while preserving the electrical connection function
Solution Approach 2:
The first metal structure acts as an intermediary element between the die and substrate, modifying the electromagnetic field distribution and preventing the formation of resonant cavities without interfering with the electrical signal transmission through the conductive bumps
2Productivity
If die integration is increased to reduce distance between functional circuits, then device functionality is improved, but electromagnetic interference between circuits becomes more prominent
Solution Approach 1:
The patent applies local quality by positioning the first metal structure specifically around or near the conductive bumps and active functional circuits where electromagnetic interference occurs, providing targeted electromagnetic isolation without affecting other areas of the die
Solution Approach 2:
The first metal structure serves as a simple, easily manufacturable solution that can be integrated into the existing flip-chip process without requiring complex additional steps or expensive materials, making it suitable for high-volume production
3Reliability
If a first metal structure is added to reduce electromagnetic interference, then electromagnetic isolation is improved, but device complexity increases
Solution Approach 1:
The patent merges the first metal structure with existing package components or integrates it into the conductive bump structure itself, combining multiple functions into a single element to minimize additional complexity while achieving electromagnetic isolation
Solution Approach 2:
The first metal structure modifies electromagnetic parameters (such as impedance, resonance frequency, or field distribution) in the package structure to suppress interference, achieving improved electromagnetic isolation through parameter optimization rather than complex structural changes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces electromagnetic interference between interference sources and susceptors, improving isolation and increasing the thermal fatigue life of the package structure, thereby enhancing the reliability of the flip-chip die package.
Implementation Method 1
a resonant cavity is formed between the upper surface of the die, the top layer of the substrate, and the conductive bump
Implementation Method 2
the filling layer may be configured to convert electromagnetic waves or an electromagnetic wave radiated or received by the first active functional circuit into thermal energy
Implementation Method 3
an upper surface of the die is electrically connected, using the plurality of conductive bumps, to a surface that is of the substrate and that faces the die
Data Source
AI summary
A flip-chip die package includes a substrate, a die, a plurality of conductive bumps, and a first metal structure, where an upper surface of the die is electrically coupled, using the conductive bumps, to a surface that is of the substrate and that faces the die, and the first metal structure includes a plurality of first metal rods disposed between the substrate and the die, where each first metal rod is electrically coupled to the substrate and the die, and the first metal rods are arranged around a first active functional circuit, and the first active functional circuit includes an electromagnetic radiation capability or an electromagnetic receiving capability in the die.