Flip-Chip Module With Integrated Supporting Frame
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Solution Overview
Problem
Existing module production methods for component chips, such as SAW filter chips, require separate housings for protection and complex assembly processes, which complicate production and increase component size.
Innovation Solution
A module design using flip-chip technology where a component chip with integrated supporting frame and elements is applied to a carrier substrate, forming a sealed cavity for protection and electrical connection, eliminating the need for separate housings and allowing for higher packing density and reduced module height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate housing is used to protect sensitive component structures, then mechanical protection is improved, but device complexity and production complexity increase
Solution Approach 1:
The patent merges the housing function with the carrier substrate by integrating the supporting frame directly into the substrate structure. The supporting frame is produced in a common method step with the carrier substrate, eliminating the need for a separate housing component. This integration provides mechanical protection for sensitive component structures while simplifying the overall device structure and reducing production complexity.
2Reliability
If a separate housing is used to protect sensitive component structures, then mechanical protection is improved, but the module height increases
Solution Approach 1:
The housing function is merged into the carrier substrate, allowing the supporting frame to be formed as an integral part of the substrate during the same production process. This eliminates the need for additional housing layers that would increase module height, while still providing the necessary mechanical protection for sensitive components.
3Adaptability or versatility
If supporting elements and supporting frame are produced separately, then manufacturing flexibility is improved, but production time and complexity increase
Solution Approach 1:
The supporting elements and supporting frame are produced in a common method step during the substrate fabrication process, before the component chip is mounted. This preliminary integration of structural elements into the substrate allows for optimized production flow and reduced assembly steps, improving both productivity and manufacturing efficiency.
Data Source
AI summary
The invention specifies a module comprising a carrier substrate (6) having an electrical wiring and a component chip mounted on the carrier substrate (6) using flip-chip technology, wherein the component chip (1) has, on its surface (2) facing the carrier substrate (6), component structures (3), a supporting frame (4) and supporting elements (5), the supporting elements (5) produce an electrical connection between the component structures (3) and the electrical wiring of the carrier substrate (6), and the height of the supporting elements and the height of the supporting frame (4) correspond. Furthermore, the invention specifies a method for producing the module.