Flip Chip Module Thermal Management via Localized Mold Compound Recess
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Solution Overview
Problem
High-performance semiconductor dies generate significant heat due to increased transistor density and operation speed, requiring improved heat dissipation in flip chip assembly without increasing package size.
Innovation Solution
A flip chip module configuration using multiple mold compounds with varying properties, including a high thermal conductivity second mold compound to fill cavities created by etching away a significant portion of the semiconductor substrate, enhancing thermal performance while maintaining package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-performance semiconductor dies with increased transistor density are used, then processing speed and performance are improved, but heat generation increases significantly
Solution Approach 1:
The patent applies local quality by creating a recess in the mold compound directly over the flip chip die and filling it with a high thermal conductivity material. This concentrates thermal management resources exactly where heat is generated (at the die location), rather than uniformly distributing thermal management materials throughout the entire package. The high thermal conductivity material is strategically placed in the recess to create a localized heat dissipation pathway.
Solution Approach 2:
The patent employs composite materials by combining mold compound with a high thermal conductivity material in a layered structure. The mold compound provides encapsulation and mechanical support, while the high thermal conductivity material (such as diamond, cubic boron nitride, or other thermally conductive substances) provides enhanced heat dissipation. This composite approach allows simultaneous achievement of protective encapsulation and improved thermal management.
2Reliability
If traditional encapsulation with mold compound is used, then die protection is achieved, but thermal performance is insufficient
Solution Approach 1:
The patent maintains die protection through the mold compound while locally enhancing thermal performance by placing high thermal conductivity material in a recess. The mold compound continues to provide encapsulation and environmental protection, while the high thermal conductivity material in the recess specifically addresses thermal management needs. This localized enhancement avoids the need to replace the entire encapsulation system.
Solution Approach 2:
The patent creates a composite structure where the mold compound provides protective encapsulation and the high thermal conductivity material provides thermal management. This composite approach allows both protection and thermal performance to be achieved simultaneously, with each material performing its specialized function in the layered configuration.
3Temperature
If substrate etching is performed to improve heat dissipation, then thermal performance is enhanced, but structural integrity may be compromised
Solution Approach 1:
The patent applies local quality by selectively removing substrate material only in the region directly beneath the flip chip die to create a recess. This localized etching provides a pathway for heat dissipation without compromising the overall structural integrity of the substrate. The substrate retains its strength in surrounding areas while providing enhanced thermal management in the specific region where heat generation occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances thermal performance of encapsulated flip chip dies by utilizing high thermal conductivity materials to dissipate heat efficiently, addressing the challenge of heat management in high-performance semiconductor devices.
Implementation Method 1
A second mold compound resides over the substrate in contact with the first mold compound and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die
Data Source
AI summary
A flip chip module having at least one flip chip die is disclosed. The flip chip module includes a carrier having a top surface with a first mold compound residing on the top surface. A first mold compound is disposed on the top surface of the carrier. A first thinned flip chip die resides over a first portion of the first mold compound with interconnects extending through the first portion to the top surface wherein the first portion of the mold compound fills a region between the first flip chip die and the top surface. A second mold compound resides over the substrate and provides a first recess over the first flip chip die wherein the first recess extends to a first die surface of the first flip chip die. A third mold compound resides in the first recess and covers an exposed surface of the flip chip die.