Flip-Chip Mounting Height Compensation via Bump and Component Thickness
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Solution Overview
Problem
In flip-chip mounted electronic devices, reducing the distance between components to minimize size and height leads to interference issues during mounting, causing physical damage and reliability degradation, and results in manufacturing challenges such as non-uniform cutting, picking up failures, and mark recognition issues due to surface inclination.
Innovation Solution
The configuration involves a mount board with first and second electronic components flip-chip mounted with bumps, where the thickness of the first component is larger than the second, and the bump height on the first component is smaller than on the second, reducing the mount height difference and inclination, thereby improving surface flatness and manufacturing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between two electronic components is decreased to reduce device size, then the device size is reduced, but the mounting tool may interfere with the mounted component causing physical damage and reliability degradation
Solution Approach 1:
The patent resolves the contradiction by transitioning from a two-dimensional layout optimization to a three-dimensional solution. Instead of merely reducing the planar distance between components, the invention introduces vertical dimension control through differential component thicknesses and varying bump heights. This dimensional shift allows components to be positioned closer horizontally while maintaining adequate clearance through vertical staggering, thus reducing device size without compromising mounting reliability.
2Reliability
If the thickness of electronic components is made different to prevent mounting tool interference, then mounting interference is prevented, but an inclination is generated at the upper surface causing manufacturing defects
Solution Approach 1:
The patent applies parameter changes by systematically varying two critical parameters: component thickness and bump height. By coordinating changes in these parameters, the invention achieves dual objectives - different thicknesses prevent mounting tool interference (improving reliability), while the specific combination of thickness and bump height variations compensates for height differences to maintain surface flatness (preserving manufacturing precision). This coordinated parameter adjustment resolves the contradiction between mounting reliability and surface flatness.
3Ease of operation
If a step is generated between upper surfaces of components by varying thickness, then mounting tool interference is prevented, but dicing quality and mark recognition are degraded due to surface inclination
Solution Approach 1:
The patent introduces the bump structure as an intermediary element that mediates between component thickness differences and the upper surface flatness requirement. By adjusting bump heights to compensate for thickness variations, the intermediary bump structure allows components of different thicknesses to be mounted without interference while maintaining a flat upper surface. This intermediary mechanism enables both mounting operation ease and dicing quality to be preserved simultaneously.
Data Source
AI summary
An electronic device includes a mount board, first and second electronic components flip-chip mounted on a surface of the mount board with bumps interposed therebetween, and a sealing member that seals the first and second electronic components on the mount board. A thickness of the first electronic component is larger than a thickness of the second electronic component, and a height of the bump bonded to the first electronic component is smaller than a height of the bump bonded to the second electronic component.