Flip-Chip Multilayer Capacitor With External Contacts
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Solution Overview
Problem
Existing electrical multilayer components require complex structures and costly production methods, including plated-through holes or vias, to facilitate flip-chip contact with printed circuit boards, which complicates the manufacturing process and increases costs.
Innovation Solution
A flip-chip contactable electrical multilayer component with external contacts of different polarities arranged on a single outer surface, where electrode layers are connected at one end to external terminals, eliminating the need for vias and allowing direct contact with a printed circuit board without overlapping in orthogonal projection, enabling a simpler and cost-effective construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plated-through holes or vias are used to connect electrode layers to external contacts, then electrical connection is achieved, but construction complexity and production cost increase
Solution Approach 1:
The patent extracts and eliminates the plated-through holes or vias from the component structure. By designing electrode layers that directly contact external contacts on the same outer surface, the invention removes the need for through-hole connections, thereby reducing construction complexity and production cost while maintaining reliable electrical connection
Solution Approach 2:
Instead of the conventional approach where external contacts are on opposite surfaces requiring through-hole connections, the patent inverts the arrangement by placing external contacts of different polarities on the same outer surface. This allows electrode layers to directly contact external contacts without requiring plated-through holes, simplifying the construction
2Reliability
If electrode layers are arranged to overlap in orthogonal projection, then capacitance is increased, but space optimization is reduced
Solution Approach 1:
The patent transitions from a vertical stacking arrangement (one dimension) to a lateral arrangement where electrode layers are positioned side-by-side on the same outer surface (two dimensions). This dimensional change allows electrode layers to be space-optimized without requiring overlap in orthogonal projection, while still achieving the necessary capacitance through the lateral configuration
3Ease of manufacture
If stacking direction is perpendicular to mounting surface, then mounting is simplified, but electrode shapes become complex requiring multiple curves
Solution Approach 1:
The patent extracts the requirement for complex curved electrode shapes by changing the mounting orientation. By arranging the stacking direction parallel to the mounting surface rather than perpendicular, the electrode layers can maintain simple shapes with direct contact to external contacts, eliminating the need for multiple curves while preserving mounting simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for efficient electrical contact with printed circuit boards using a single outer surface, reducing production complexity and costs, while enabling space-optimized electrode shapes and generating small capacitances suitable for microelectronics applications.
Implementation Method 1
Electrode layers with different poles in interaction with a dielectric layer located between them can generate capacitances that help determine the electrical properties of the multilayer component or of the multilayer structures in the multilayer component
Data Source
Figure 1a~1c
Figure 2a~2d
Figure 3a~3d
AI summary
The invention relates to an electric multilayer component, comprising a stack (1) of dielectric layers (2) and electrode layers (3), which are disposed next to each other, and differently polarized outer contacts (4a, 4b) which are disposed at an outside surface (5a) of the stack (1) and can be contacted with flipchips, characterized in that the electrode layers are connected on one end to a respective outer connection having the same polarity.