Flip-Chip Mounting With Offset Terminals and Inclined Board Contacts
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Solution Overview
Problem
Conventional flip-chip bonding methods often result in positional deviations of electronic components on mount boards due to inaccuracies in positioning between component and board terminals, leading to issues like component misalignment and potential short circuits, especially with large-sized or high-pin-count components.
Innovation Solution
The method involves providing at least two component terminals and two board terminals with inclined portions on the board terminals, where one component terminal is offset in one direction and the other in the opposite direction relative to their corresponding board terminals, allowing them to bond and balance positional deviations, thereby preventing misalignment during flip-chip bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional flip-chip bonding is used with sharp-tipped component terminals, then bonding speed and simplicity are improved, but positional deviation between component terminals and board terminals occurs leading to component misalignment
Solution Approach 1:
The component terminal tip is flattened in advance before the bonding process. This preliminary action prevents positional deviation during bonding by creating a stable contact surface that can accommodate minor positioning errors, thereby maintaining both bonding efficiency and positioning accuracy without requiring extremely precise alignment.
Solution Approach 2:
The shape parameter of the component terminal tip is changed from sharp to flat. This parameter change allows the terminal to better tolerate positioning variations during bonding, reducing the impact of alignment errors while maintaining bonding speed and simplicity.
2Manufacturing precision
If tip end flattening is performed on component terminals, then positional deviation is reduced, but manufacturing process complexity increases
Solution Approach 1:
The flattening process is integrated into the existing bonding equipment workflow, allowing the component terminal to be flattened in-situ without requiring separate external processing equipment. This self-service approach reduces process complexity by utilizing resources already available in the bonding system.
Solution Approach 2:
The flattening operation is combined with the bonding process into a single integrated workflow. By merging these two operations, the patent eliminates the need for separate flattening equipment and processes, thereby reducing overall manufacturing complexity while maintaining positioning accuracy.
3Manufacturing precision
If multiple component terminals are used with offsets in opposite directions, then positional deviation is balanced and prevented, but device structure becomes more complex
Solution Approach 1:
Component terminals are intentionally positioned with asymmetric offsets in opposite directions rather than perfect symmetry. This asymmetric arrangement creates balancing effects that cancel out positional deviations, improving positioning accuracy while maintaining a relatively simple terminal structure.
Solution Approach 2:
The offset positioning of component terminals creates a counterbalancing effect where deviations in one direction are compensated by opposite deviations in another direction. This counterweight principle reduces overall positional deviation without requiring complex active control mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents positional deviations of electronic components on the mount board, eliminating the need for tip end flattening and enhancing the reliability of flip-chip bonding for both small and large-sized components with multiple pins, even under conditions of strong vibrations or high pressures.
Implementation Method 1
pressures, vibrations, heat or the like is applied thereto. Thereby the component terminal and the board terminal are electrically bonded
Implementation Method 2
the component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal
Implementation Method 3
pressures, vibrations, heat or the like is applied thereto. Thereby the component terminal and the board terminal are electrically bonded
Data Source
AI summary
An electronic component is provided with two or more component terminals. A mount board is provided with two or more board terminals. The board terminal is provided with an inclined portion on a surface of the board terminal, the inclined portion being the wider as closer to a base end side toward a peripheral edge. A position of the component terminal is offset in relation to a position of the corresponding board terminal. A position of the other component terminal is offset in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal. The component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal.