Flip Chip Optical Transceiver With Micro Structure Alignment
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Solution Overview
Problem
Traditional optical transceivers face challenges in achieving precision alignment of optical components, leading to increased manufacturing time and cost, particularly in smaller form factors, due to the complexity and expense of mechanical fixing and active alignment methods.
Innovation Solution
The implementation of passive alignment using micro-engineered structures and alignment pins within the optical transceiver semiconductor die, allowing for precise alignment without the need for complicated manufacturing steps and enabling flip chip connections, which reduces the profile and form factor of the optical transceiver assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical fixing methods are used to secure the optical lens, then the lens can be securely attached, but the manufacturing process becomes time-consuming and expensive
Solution Approach 1:
The patent pre-positions the optical lens during the semiconductor fabrication process using temporary structures and alignment marks before final die attachment. This preliminary alignment action eliminates the need for time-consuming post-attachment mechanical fixing, as the lens is already in its correct position when the die is mounted on the substrate
Solution Approach 2:
The patent replaces traditional mechanical fixing methods (screws, clips, adhesives) with a passive alignment system based on geometric constraints. The lens holder features precision-machined recesses and protrusions that mechanically constrain the lens position through geometric interlocking rather than active fastening mechanisms
2Manufacturing precision
If active alignment methods are used during manufacturing, then precision alignment can be achieved, but the process complexity and cost increase significantly
Solution Approach 1:
The patent implements a passive alignment system where the lens holder and die automatically self-align through precisely machined geometric features. The recesses in the lens holder and corresponding protrusions on the die create a self-correcting alignment mechanism that eliminates the need for active alignment equipment, light-based alignment systems, or complex adjustment procedures
Solution Approach 2:
Alignment marks and geometric reference features are pre-established during semiconductor fabrication before die attachment. These pre-formed features serve as built-in alignment references that guide the lens positioning process, eliminating the need for post-fabrication alignment measurements and adjustments
3Reliability
If traditional multi-step manufacturing processes are used, then comprehensive assembly can be achieved, but the overall manufacturing time increases
Solution Approach 1:
The patent merges multiple discrete manufacturing steps into a single integrated die attachment process. The lens positioning, die mounting, and electrical interconnection are combined into one simultaneous operation, eliminating the sequential execution of separate steps and thereby increasing manufacturing throughput while maintaining assembly completeness
Solution Approach 2:
The optical lens and its holder are pre-assembled and pre-aligned during semiconductor fabrication before die attachment. This preliminary preparation ensures that when the die is mounted, the optical components are already in their correct positions, eliminating the need for subsequent lens alignment and adjustment steps
Data Source
AI summary
A system includes an optical transceiver assembly, including a flip chip connection of a semiconductor die with a photonic transceiver that overhangs a substrate to which it is to be connected. The assembly further includes an alignment pin that is held to the semiconductor die at a micro-engineered structure in the semiconductor die. The alignment pin provides passive alignment of the photonic transceiver with an optical lens that interfaces the photonic transceiver to one or more optical channels.