Flip-Chip Semiconductor Package With Exposed Heat-Dissipating Surfaces
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Solution Overview
Problem
Conventional semiconductor device packages face issues with parasitic effects and high heat generation at high frequencies, leading to performance deterioration and assembly costs due to wirebond connections, which affect impedance matching and heat dissipation.
Innovation Solution
Implementing a flip-chip configuration with exposed heat dissipating surfaces on semiconductor devices, utilizing thermally conductive members and protective structures to dissipate heat away from the package, and optimizing the bottom side for electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirebond connections are used in conventional semiconductor device packages, then electrical connections can be established, but parasitic effects increase and assembly costs increase at high frequencies
Solution Approach 1:
The patent removes wirebond connections from the package structure and replaces them with direct flip-chip bonding. This extraction of the problematic wirebond element eliminates the parasitic inductance and resistance associated with wire bonds, directly resolving the technical contradiction between maintaining electrical connections and reducing parasitic effects at high frequencies
Solution Approach 2:
The patent replaces the mechanical wirebond system with a direct semiconductor-to-substrate bonding system. This substitution eliminates the need for wire bonds and their associated parasitic effects, while maintaining electrical connectivity through direct metal-to-metal or semiconductor-to-substrate bonds in a flip-chip configuration
2Reliability
If wirebond connections are used in conventional semiconductor device packages, then electrical connections can be established, but assembly costs increase
Solution Approach 1:
By extracting wirebond connections from the assembly process and replacing them with direct flip-chip bonding, the patent eliminates material costs (wire bonds) and process costs (wire bonding equipment and operations), directly reducing assembly costs while maintaining electrical connection performance
Solution Approach 2:
The patent changes the bonding parameter from wire-based indirect bonding to direct semiconductor-to-substrate bonding. This parameter change simplifies the manufacturing process, reduces material usage, and lowers assembly costs while improving electrical performance through shorter current paths
3Temperature
If heat is dissipated through the bottom side of the package, then heat conduction paths are established, but they interfere with external device functionality
Solution Approach 1:
The patent transitions heat dissipation from a vertical path through the bottom substrate to a lateral path through the package edges and top surface. This dimensional change in heat conduction routing allows the bottom surface to be used for external device functionality while maintaining effective heat dissipation through alternative pathways
Solution Approach 2:
The patent segments the heat dissipation function across multiple surfaces and pathways (top surface, side walls, and distributed thermal vias) rather than relying on a single bottom-mounted heat sink. This segmentation allows the bottom surface to serve dual purposes while maintaining thermal management effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces parasitic effects, improves heat dissipation, and enhances operational efficiency by routing heat conduction paths away from the external device, allowing additional functionality and reduced assembly costs.
Implementation Method 1
utilizing thermally conductive members and protective structures to dissipate heat away from the package
Data Source
AI summary
A semiconductor device package includes an interconnect structure with a first surface having at least one die thereon and a second surface that is opposite the first surface and is configured to be coupled to an external device. A protective structure on the first surface of the interconnect structure exposes a heat dissipating surface facing away from the interconnect structure in one or more directions. Related devices and fabrication methods are also discussed.