Flip-Chip Package System With Die Receptacle For Low-Profile Stacking
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Solution Overview
Problem
Existing multi-chip package systems, such as PiP and PoP, lack versatility and interconnection capabilities, and are limited in thickness, making them unsuitable for larger packages and modern low-profile electronic devices, which requires a solution that enhances modularity and interconnection while minimizing package thickness.
Innovation Solution
A method involving a flip-chip assembly with a first semiconductor die mounted on a second die using an inter-die interconnect, attached to a package substrate with a contact pad, test connection, and z-bond pad, allowing the first die to fit inside a die receptacle, enabling greater interconnection and modularity with reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If PiP or PoP packages are used, then modularity is provided, but interconnection capabilities are insufficient and package thickness is not minimized
Solution Approach 1:
The patent implements a nested package structure where a first package is positioned within a second package, and a third package is positioned within the first package. This nesting arrangement enables multiple semiconductor dies to be integrated in a compact configuration, providing enhanced interconnection capabilities while minimizing the overall package thickness by utilizing vertical stacking rather than lateral expansion.
2Adaptability or versatility
If existing PiP or PoP packages are used, then some modularity is achieved, but versatility for integration into larger multi-chip packages is insufficient
Solution Approach 1:
The patent divides the multi-chip package into multiple independent package modules, each containing semiconductor dies mounted on separate package substrates. These segmented packages can be independently tested and then integrated into larger multi-chip configurations. The segmentation provides versatility for integration while managing complexity through standardized interfaces and modular assembly procedures.
Solution Approach 2:
The patent creates universal package modules with standardized substrates and interconnection interfaces that can serve multiple functions. Each package module can be independently tested, integrated into various multi-chip configurations, and interconnected through multiple methods (wire bonds, solder bumps, or other techniques). This universality enhances versatility while reducing overall system complexity through reuse of standardized components.
3Productivity
If multiple semiconductor dies are connected on a single package substrate, then multi-chip functionality is achieved, but yield loss increases and testing capability is reduced
Solution Approach 1:
The patent segments the multi-chip module into multiple independent packages, each containing one or more semiconductor dies mounted on separate package substrates. This segmentation enables independent testing of each package module before final assembly, allowing defective modules to be identified and replaced without affecting other modules. This approach reduces yield loss by isolating failures to individual modules rather than requiring rejection of entire multi-chip assemblies.
Solution Approach 2:
The patent implements preliminary testing of each package module independently before integration into the final multi-chip package. Test connections are provided on each package substrate, enabling functional testing of semiconductor dies and interconnections at the module level. This preliminary action identifies defective modules early in the manufacturing process, allowing for replacement or rework before final assembly, thereby improving overall yield and reliability.
Data Source
AI summary
A method for manufacturing a package system includes: providing a first semiconductor die; mounting a second semiconductor die on the first semiconductor die using an inter-die interconnect to form a flip-chip assembly; and attaching the flip-chip assembly on a package substrate with a contact pad, a test connection, a z-bond pad, and a die receptacle, with the first semiconductor die in the flip-chip assembly fitting inside the die receptacle.