Flip Chip Mounting on PCB for Dual Display Packaging
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Solution Overview
Problem
Conventional liquid crystal display apparatuses face challenges in packaging density due to the large size of control chips mounted on printed circuit boards using the ball grid array method, which occupies significant space and limits the accommodation of additional circuits and components like cameras in dual-panel displays.
Innovation Solution
The use of a flip chip mounted onto a base substrate with an adhesive member, such as an anisotropic conductive film or epoxy resin, reduces the size of the flip chip, allowing for increased packaging density by freeing up space on the printed circuit board for additional components, including dual display panels and camera parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the control chip is mounted on the printed circuit board by the ball grid array method using a solder ball, then the control chip can be securely fixed, but the control chip requires more space which reduces the available space for mounting other circuits
Solution Approach 1:
The patent transitions from the conventional ball grid array mounting method to a flip chip mounting method. This dimensional change in mounting approach allows the control chip to be inverted and mounted directly onto the printed circuit board, significantly reducing the required space while maintaining secure fixation through adhesive members and conductive patterns.
Solution Approach 2:
The patent changes the mounting parameters by switching from solder ball connections to adhesive member fixation with conductive patterns. This parameter change enables the control chip to be mounted in a flipped orientation, reducing the space requirement from approximately 1.5 times the chip size to just the chip size itself, thereby increasing the available space on the printed circuit board.
2Adaptability or versatility
If the control chip incorporates various added functions for dual-panel type or camera-equipped apparatuses, then the control chip can operate those apparatuses, but the printed circuit board requires a relatively large space to accommodate the control chip
Solution Approach 1:
The flip chip mounting method enables the control chip to be mounted in an inverted position, which fundamentally changes the spatial relationship between the chip and the printed circuit board. This dimensional change allows the chip to occupy minimal space while still providing all necessary connection points for dual-panel and camera functions through the conductive patterns on the adhesive member.
Solution Approach 2:
The control chip is designed with universal multi-functionality to support both dual-panel display operations and camera operations. By integrating multiple functions into a single chip and using the flip chip mounting method, the patent achieves adaptability for various apparatus configurations without requiring additional space on the printed circuit board.
3Ease of manufacture
If more space is allocated for the control chip, then the control chip can be properly mounted with adequate soldering space, but less space is available for mounting other circuits
Solution Approach 1:
The patent changes the manufacturing parameters by replacing the solder ball array method with an adhesive member and conductive pattern approach. This parameter change eliminates the need for extensive soldering space around the control chip, as the adhesive member provides both mechanical fixation and electrical connection through its conductive patterns, thereby significantly increasing packaging density.
Solution Approach 2:
The patent substitutes the mechanical solder ball connection system with an adhesive member system that incorporates conductive patterns. This substitution replaces the traditional mechanical and thermal bonding process with a chemical adhesion process, eliminating the need for large soldering areas and improving the overall packaging density of the printed circuit board.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration decreases the size of the flip chip, thereby increasing the available space on the printed circuit board, enabling the integration of additional features like dual display panels and camera modules without the need for extensive re-design, enhancing overall packaging efficiency.
Implementation Method 1
The flip chip is fixed onto the base substrate by the adhesive member between the base substrate and the flip chip
Data Source
AI summary
In a display apparatus, a printed circuit board has a base substrate, a flip chip, and an adhesive member. The flip chip is mounted onto a first face of the base substrate by the adhesive member between the flip chip and the first face of the base substrate. The first display panel is disposed on a second face opposite to the first face of the base substrate, and a second display panel is mounted on the first face of the base substrate with the flip chip. Thus, a chip mounted on the printed circuit board is made smaller and the freed up space can be used to mount the second display panel.