Flip Chip Space Pixel Arrangement for LED Display Resolution
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Solution Overview
Problem
Existing display technologies face limitations in achieving high resolution and brightness due to the upper density limit of sub-pixel arrangement, particularly in Micro (Mini) inorganic light emitting diode (LED) displays, where the distance between sub-pixel light emitting regions becomes increasingly smaller as resolution requirements improve.
Innovation Solution
A flip chip space pixel arrangement structure and pixel multiplexing method that equidistantly divides the LED display screen into first and second element sets, forming a light emitting tube array with specific white light point groups, using a pixel acquisition algorithm to split the original image into low-resolution basic images, and determining display orders to optimize sub-pixel reconstruction and reduce interference between sub-pixels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sub-pixel arrangement density is increased to achieve high resolution, then resolution is improved, but distance requirements between sub-pixel light emitting regions become increasingly smaller causing limitations in heat dissipation and component size
Solution Approach 1:
The invention divides the display screen into multiple element sets (first element sets and second element sets) with different functions. First element sets contain complete RGB sub-pixels for standard display, while second element sets contain only R and B sub-pixels that cooperate with first element sets to form additional white light pixels. This segmentation allows increasing pixel density without proportionally decreasing the size of each functional unit.
Solution Approach 2:
The invention transitions from a traditional two-dimensional uniform sub-pixel arrangement to a three-dimensional functional arrangement by creating multiple element sets at different spatial positions and functions. Second element sets are positioned between first element sets and serve as auxiliary pixels that cooperate with first element sets, effectively adding a vertical/dimensional layer to the pixel structure that increases density without compressing horizontal spacing.
2Quantity of substance
If sub-pixel arrangement density is increased to achieve high resolution, then pixel density is improved, but component size limitations are reached
Solution Approach 1:
First element sets serve dual functions: they display standard RGB pixels independently, and they also cooperate with second element sets to form additional white light pixels. This multi-functionality increases the effective pixel density without requiring additional physical components beyond the second element sets.
Solution Approach 2:
The invention merges the function of complete RGB pixels with auxiliary R and B sub-pixels. Second element sets (containing only R and B sub-pixels) are merged with first element sets to form cooperative white light pixels, effectively combining limited components to achieve higher pixel density than traditional complete RGB pixel arrangements.
3Measurement precision
If sub-pixel arrangement density is increased to achieve high resolution, then resolution is improved, but heat dissipation capability deteriorates
Solution Approach 1:
By segmenting the display into first element sets (complete RGB) and second element sets (R and B only), the invention creates spatial separation between different functional units. This segmentation allows heat generated in first element sets to dissipate independently from second element sets, preventing heat accumulation that would occur in densely packed uniform sub-pixel arrangements.
Solution Approach 2:
Different element sets have different local qualities and functions. First element sets with complete RGB sub-pixels handle primary display functions, while second element sets with only R and B sub-pixels serve as auxiliary pixels. This local differentiation allows optimization of heat dissipation in high-density regions by not uniformly distributing all high-power RGB sub-pixels throughout the display.
4Ease of manufacture
If traditional uniform sub-pixel arrangement is used, then manufacturing is simplified, but pixel density is limited
Solution Approach 1:
The display is segmented into first element sets and second element sets that can be manufactured using different processes optimized for their specific requirements. First element sets with complete RGB pixels can be manufactured using standard processes, while second element sets with only R and B sub-pixels can be manufactured separately and then integrated, allowing flexible manufacturing approaches that maintain simplicity while achieving high density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases pixel density, improves resolution, reduces power consumption, and enhances display efficiency by allowing multiple sub-pixels to be combined into a single pixel set, driven by a single driver, thereby achieving high pixel density and high resolution with reduced visual graininess and cross-color phenomena.
Implementation Method 1
a pixel multiplexing method based on a flip chip space pixel arrangement structure includes: S1, equidistantly dividing, in rows and columns, pixel points of a light emitting diode (LED) display screen
Data Source
AI summary
Provided is a flip chip space pixel arrangement structure, a pixel multiplexing method and system, an apparatus and a storage medium. The pixel multiplexing method includes: equidistantly dividing, in rows and columns, an LED display screen into a plurality of first element sets and a plurality of second element sets; on the basis of a pixel acquisition algorithm, sampling a single frame of original image having high resolution into seven basic images having low resolution; on the basis of a determination strategy, formulating display orders of the basic images, the single frame of original image corresponding to three display orders, and each of the display orders corresponding to one or more of the basic images; and on the basis of the display orders, sequentially displaying each of the basic images in a single frame duration, to complete sub-pixel reconstruction of the flip chip space pixel arrangement structure.