Flip Chip Assembly for Quantum Devices Using Self-Aligning Protrusions
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Solution Overview
Problem
Current methods for quantum device assembly lack positional accuracy and effective heat transfer, which are crucial for reliable quantum computing operations.
Innovation Solution
A quantum computing device and fabrication method utilizing an interposer layer with vias and transmission lines, coupled with qubit chips having protrusions and recesses for self-alignment, and a heat sink for thermal management, along with solder bumps for bonding, using materials like Indium, Tin, Bismuth, Titanium, Silver, Copper, Platinum, and Gold for enhanced thermal conductivity and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional assembly methods are used for quantum devices, then the assembly process is simple, but positional accuracy is insufficient
Solution Approach 1:
The qubit chip incorporates self-aligning protrusions that automatically position themselves relative to recesses on the interposer and heat sink during assembly. This self-alignment mechanism eliminates the need for complex external alignment equipment or procedures, achieving high positional accuracy through the component's own structural features
Solution Approach 2:
The protrusions are pre-formed on the qubit chip during fabrication, and the heat sink recesses are pre-formed on the interposer before assembly. This preliminary preparation of alignment features ensures that when components are brought together, they automatically achieve the correct positional relationship without requiring complex real-time adjustment procedures
2Reliability
If conventional assembly methods are used for quantum devices, then the assembly process is simple, but heat transfer effectiveness is insufficient
Solution Approach 1:
The heat sink is designed with localized recesses that precisely match the location and shape of protrusions on the qubit chip. This local geometric correspondence ensures optimal thermal contact at the critical heat transfer interface, maximizing heat transfer effectiveness through tailored local geometry rather than uniform contact surfaces
Solution Approach 2:
The self-aligning protrusion-recess mechanism also serves the dual function of ensuring thermal contact. As the protrusions automatically position themselves into the heat sink recesses, they simultaneously establish the optimal thermal pathway from the qubit chip to the heat sink, eliminating the need for separate thermal contact adjustment procedures
3Reliability
If specialized materials are used for enhanced thermal conductivity and bonding, then thermal conductivity and bonding strength are improved, but manufacturing complexity increases
Solution Approach 1:
The assembly utilizes specialized materials such as Indium, Tin, Bismuth, Titanium, Silver, Copper, Platinum, and Gold for solder bumps and bonding layers. These composite material selections provide enhanced thermal conductivity and bonding strength at the interfaces between qubit chips, interposer, and heat sink, achieving superior reliability through material composition rather than structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved positional accuracy and efficient heat transfer, ensuring reliable quantum computing operations by aligning qubit chips and heat sinks effectively, while the chosen materials enhance thermal conductivity and bonding strength.
Implementation Method 1
a heat sink thermally coupled with the plurality of qubit chips
Implementation Method 2
solder bumps for bonding
Data Source
AI summary
In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.