Flip-Chip Qubit Co-Packaging With Underfill Protection
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Solution Overview
Problem
Superconducting quantum computing systems face challenges with excessive physical space consumption and cryogenic cooling difficulties due to separate packaging of superconducting qubit and parametric Josephson devices, which also leads to mechanical and chemical degradation of parametric Josephson devices during fabrication and handling.
Innovation Solution
A high-density flip-chip co-package architecture that couples superconducting qubits and parametric Josephson devices together using bump-bonds and an underfill, eliminating the need for separate packaging and protecting the parametric Josephson devices from mechanical and chemical damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If superconducting qubit and parametric Josephson devices are packaged separately, then each device can be independently handled and fabricated, but the physical space consumption increases and cryogenic cooling becomes more difficult
Solution Approach 1:
The patent combines separately packaged superconducting qubit devices and parametric Josephson devices into a single integrated package. The qubit device and Josephson device are mounted on the same substrate with their respective components (qubit chip, Josephson chip, coaxial cables, connectors) integrated together, eliminating the need for separate packaging and reducing overall physical space while maintaining independent fabrication capabilities through modular chip design.
2Ease of manufacture
If superconducting qubit and parametric Josephson devices are packaged separately, then each device can be independently handled, but cryogenic cooling and temperature control become more difficult
Solution Approach 1:
By integrating both devices in a single package with shared thermal management infrastructure (common substrate, unified mounting structure, proximal positioning), the patent enables more effective cryogenic cooling. The combined package allows for unified temperature control and reduced thermal mass compared to separate packages, while the modular chip design preserves independent handling capabilities during fabrication and assembly.
3Ease of manufacture
If superconducting qubit and parametric Josephson devices are packaged separately, then device modularity is maintained, but mechanical and chemical degradation occurs during fabrication and handling of the parametric Josephson devices
Solution Approach 1:
The patent applies preliminary protective action by coating the parametric Josephson device with a protective layer (such as conformal dielectric coating or encapsulation material) before integration into the package. This protective coating is applied in advance to prevent mechanical damage and chemical degradation during subsequent fabrication processing and handling, while the modular chip design maintains device modularity for independent fabrication.
4Ease of manufacture
If separate packaging is used, then device independence is preserved, but the overall system complexity increases
Solution Approach 1:
The patent merges multiple separate packaging systems into a single integrated package structure that contains both the qubit device and Josephson device. This integration reduces system complexity by eliminating duplicate packaging components, connectors, and mounting structures, while the modular chip architecture preserves device independence for fabrication and replacement purposes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a more compact, efficient spatial arrangement of qubits and Josephson devices with reduced mechanical and chemical degradation, facilitating scalable quantum computing without the need for extensive cryogenic refrigeration and minimizing damage to parametric devices.
Implementation Method 1
a superconducting qubit wafer coupled, by one or more first bump-bonds, to a parametric Josephson wafer
Implementation Method 2
the first underfill can protect the at least one first parametric Josephson device from mechanical and/or chemical degradation associated with fabrication processing of the at least one superconducting qubit
Implementation Method 3
at least one superconducting qubit comprising a Josephson junction can be located on a first side of the superconducting qubit wafer
Data Source
AI summary
Systems and techniques that facilitate high-density flip-chip co-packages for superconducting qubits and parametric Josephson devices are provided. In various embodiments, a device can comprise a superconducting qubit wafer that can be coupled, by one or more first bump-bonds, to a parametric Josephson wafer. In various aspects, the device can further comprise a first underfill that surrounds the one or more first bump-bonds. In various instances, the first underfill can protect the parametric Josephson wafer from mechanical and/or chemical degradation associated with subsequent fabrication, processing, and/or handling of the superconducting qubit wafer.