Flip Chip Qubit Frequency Tuning via Interposer Conductive Surface

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Solution Overview

Problem

Fixed-frequency qubits in quantum processors face challenges such as frequency crowding, crosstalk, quantum decoherence, and imperfections in fabrication, leading to difficulties in controlling qubit resonance frequencies and enabling quantum gates without unwanted interactions.

Innovation Solution

A superconducting device and method for tuning qubit frequencies using a flip chip geometry, where a conductive surface on an interposer chip adjusts the resonance frequency of qubits based on measurements, such as Josephson junction resistance, to mitigate frequency collisions and achieve precise frequency control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If fixed-frequency qubits are used in quantum processors, then fabrication simplicity is maintained, but frequency crowding and crosstalk occur leading to poor quantum gate performance

Engineering Contradiction:
Improvequantum gate performanceVSAvoidfrequency control mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements dynamic frequency tuning of qubits by introducing adjustable inductance elements that allow the resonance frequency of each qubit to be dynamically adjusted after fabrication. This enables the quantum processor to adapt qubit frequencies to avoid crowding and crosstalk, thereby improving quantum gate performance without requiring complex fabrication processes.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the electrical parameters of the qubit circuit by introducing adjustable inductance elements that modify the resonance frequency of individual qubits. By varying the inductance parameter, the system can tune qubit frequencies to optimal values, preventing frequency collisions and improving quantum gate operations.

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If additional processing steps are applied to tune qubit frequencies, then frequency control precision is improved, but the risk of junction damage increases

Engineering Contradiction:
Improvequbit frequency controlVSAvoidjunction integrity
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-assembling the quantum processor with adjustable inductance elements before final frequency optimization. This allows frequency tuning to be performed non-destructively after assembly, avoiding the need for additional processing steps that could damage the delicate Josephson junctions while still achieving precise frequency control.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate control of qubit resonance frequencies, preventing frequency collisions and improving the performance of quantum gates by enabling both increase and decrease in qubit frequency without additional processing steps on the qubit chip, thus reducing the risk of junction damage.

Implementation Method 1

at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS11527697B2Qubit frequency tuning structures and fabrication methods for flip chip quantum computing devices
Publication Date: 2022.12.13 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US11527697B2 patent drawing
  • US11527697B2 patent drawing
  • US11527697B2 patent drawing

AI summary

A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.