Flip-Chip Resin Layout for Compact Low-Warpage Image Sensors
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Solution Overview
Problem
The existing semiconductor devices with flip-chip mounting technology face challenges in reducing device size while incorporating both underfill and light-shielding resins, leading to increased thickness and warpage issues that affect image quality.
Innovation Solution
A semiconductor device design where the back surface of the chip is protected by a first resin and the side surface by a second resin, both with different materials, allowing for reduced resin application areas and improved thermal expansion matching, thereby minimizing device size and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the upper surface and side surface of a chip are covered with a light-shielding resin, then light shielding performance is improved, but device size increases and warpage occurs
Solution Approach 1:
The patent divides the resin protection into two separate segments: underfill resin for the back surface and light-shielding resin for the side surface. This segmentation allows each resin to perform its specific function without the other, enabling reduced overall resin thickness while maintaining both light shielding and protective functions
Solution Approach 2:
The patent applies different resin materials to different locations of the chip based on local requirements. The underfill resin is applied to the back surface where mechanical protection and stress distribution are needed, while the light-shielding resin is applied to the side surface where light blocking is the primary requirement. This localized application optimizes both device size and functional performance
2Object-affected harmful factors
If the upper surface and side surface of a chip are covered with a light-shielding resin, then light shielding performance is improved, but warpage of the substrate increases affecting image quality
Solution Approach 1:
By segmenting the resin application into back surface (underfill) and side surface (light-shielding), the patent reduces the total amount of resin required. This reduced resin quantity minimizes the stress and weight imbalance that causes substrate warpage, thereby maintaining better image quality
Solution Approach 2:
The patent uses composite material strategy by selecting different resin materials for different surfaces based on their specific properties. The underfill resin is chosen for its protective and stress-distributing characteristics on the back surface, while the light-shielding resin is selected for its optical blocking properties on the side surface, optimizing both structural stability and light shielding
3Reliability
If both underfill resin and light-shielding resin are used, then protective function is improved, but production time increases
Solution Approach 1:
The patent segments the resin application process into two distinct steps with different objectives, allowing each step to be optimized independently. The underfill resin application focuses on back surface protection, while the light-shielding resin application focuses on side surface coverage. This segmentation enables more efficient production by reducing rework and inspection time compared to applying a single thick resin layer
Solution Approach 2:
The patent applies resin only where absolutely necessary - underfill resin on the back surface for protection and light-shielding resin on the side surface for optical blocking. This partial action approach reduces the total resin application time and curing time compared to applying resin to all surfaces, thereby reducing overall production time while maintaining adequate protective function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces device size, minimizes resin usage, shortens production time, and enhances image quality by suppressing warpage and flare effects, while maintaining effective light shielding.
Implementation Method 1
The underfill resin enters the gap between the chip and the substrate or the gap between the chips due to, for example, capillary action in the process of producing a semiconductor device
Data Source
AI summary
The present technology relates to a semiconductor device that includes an underfill resin and a light-shielding resin and allows to achieve a decrease in device size, a method of producing the same, and an electronic apparatus. The semiconductor device includes: a substrate having a pixel region in which a plurality of pixels is arranged; and one or more chips flip-chip bonded to the substrate via a connection terminal. A material of a first resin that protects a back surface of the chip and a material of a second resin that protects a side surface of the chip are different from each other. The present technology is applicable to, for example, a semiconductor device in which an image sensor chip and a signal processing chip are flip-chip bonded to each other.