Flip-Chip Resonator Layout for Higher Qubit Density

The patent transitions from a two-dimensional chip design to a three-dimensional stacked architecture by dividing the resonator circuit into multiple layers (first substrate and second substrate) connected via bump bonds. This vertical stacking enables higher qubit density by utilizing the third dimension (height) rather than only the planar dimensions, effectively increasing the number of qubits that can be integrated without proportionally increasing the chip footprint.

The resonator circuit is segmented into multiple independent portions distributed across different substrates. Specifically, the resonator is divided such that some elements reside on the first substrate while others are placed on the second substrate, connected through inter-layer bump bonds. This segmentation allows each substrate to be optimized independently and enables higher density integration by distributing circuit elements vertically.

The patent employs vertical stacking to increase the number of coupled qubits without increasing the chip footprint area. By placing resonator portions on multiple stacked substrates and connecting them via bump bonds, the design effectively moves circuit elements from the planar domain to the vertical domain, achieving higher qubit integration density within the same footprint.

The patent implements a nested configuration where multiple circuit elements and resonator portions are arranged in a compact, space-efficient manner across stacked substrates. The bump bonds serve as vertical interconnects that nest the different substrate layers together, allowing multiple qubits to be coupled in a compact volume rather than spread out in a large planar area.

The patent segments the resonator circuit into multiple portions that can be independently designed, fabricated, and optimized on separate substrates. This segmentation provides design freedom for tailoring resonance modes and coupling characteristics while allowing each substrate to be manufactured using standard processes. The bump bond interconnects provide a reliable method for assembling the segmented components.

The patent introduces bump bonds as intermediary elements that facilitate the connection between circuit elements on different substrates. These bump bonds serve as both mechanical anchors and electrical interconnects, enabling the distributed resonator design while maintaining signal integrity. The use of standard bump bonding techniques keeps the manufacturing process compatible with existing semiconductor fabrication capabilities.