Flip Chip Semiconductor Back Surface Film

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Solution Overview

Problem

The challenge in semiconductor manufacturing is the generation of warp in thin flip chip semiconductor elements during thermal curing of encapsulating resins, which increases production costs and reduces yield due to additional processing steps and potential damage during handling.

Innovation Solution

A film for flip chip type semiconductor back surfaces containing 70% to 95% inorganic filler by weight, integrated with a dicing tape, is used to enhance mechanical strength and prevent warp, while also simplifying the production process by eliminating the need for a separate protective film attachment step.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a protective film is attached to the back surface of semiconductor chips, then the mechanical strength is enhanced, but the number of processing steps increases and production cost increases

Engineering Contradiction:

Improvemechanical strengthVSAvoidnumber of processing steps

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent combines the protective film and dicing tape into a single integrated structure. The dicing tape serves dual purposes: as a support medium during dicing operations and as a protective film for the back surface of semiconductor chips. This eliminates the need for separate protective film attachment steps, reducing processing complexity while maintaining mechanical strength enhancement.

Inventive Principle:

Principle #5Merging (Combining)

2Length of moving object

If the semiconductor chips are thinned for miniaturization, then the device size is reduced, but the chips become susceptible to damage and warp generation

Engineering Contradiction:

Improvechip thicknessVSAvoiddamage resistance

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent applies the protective film to the back surface of semiconductor wafers before the dicing step. This preliminary protection ensures that thin chips are safeguarded from damage during subsequent handling and processing operations. The film is attached in advance when the wafer is still in its robust form, providing immediate protection against warp and damage throughout the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

3Length of moving object

If the semiconductor chips are thinned, then the device is miniaturized, but warp generation occurs during thermal curing

Engineering Contradiction:

Improvechip thicknessVSAvoidwarp

Core Design Contradiction:

Length of moving objectVSShape

Solution Approach 1:

The patent uses the protective film as a counterbalancing element that offsets warp forces generated during thermal curing of encapsulating resins. The film adheres to the back surface of the chip, providing a restraining force that counteracts the upward or downward warp tendencies caused by differential thermal expansion and contraction during curing processes.

Inventive Principle:

Principle #8Anti-weight (Counterweight)

Data Source

PatentUS9074113B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Publication Date: 2015.07.07 NITTO DENKO CORP

AI summary

The present invention relates to a film for flip chip type semiconductor back surface to be formed on a back surface of a semiconductor element flip chip-connected to an adherend, the film for flip chip type semiconductor back surface containing an inorganic filler in an amount within a range of 70% by weight to 95% by weight based on the whole of the film for flip chip type semiconductor back surface.