Flip-Chip Sensor Substrate Opening and Adhesive Ring

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Solution Overview

Problem

Existing electronic devices, such as pressure sensors and actuators, face challenges in providing a reliable connection between the outer environment and the sensor or actuator elements, as they require a means to transmit signals while maintaining the integrity of the fragile mechanical structures within.

Innovation Solution

The electronic device employs a flip-chip configuration with a substrate opening and an encapsulation material opening, allowing for signal passage while using a ring-like structure of adhesive or glue with anisotropic electrical conductivity to prevent encapsulation material from entering the sensitive areas, and utilizing copper pillars or bumps for electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a connection is provided between the outer space and the sensor element, then signal transmission is enabled, but encapsulation material may enter and damage the fragile mechanical structures

Engineering Contradiction:

Improvesignal transmissionVSAvoidencapsulation material intrusion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The device is divided into separate functional zones: the sensor element area, the opening for signal transmission, and the encapsulation material containment area. The wall structure segments the encapsulation material from the sensor element, allowing signal passage while preventing material intrusion.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The wall structure acts as an intermediary element between the opening and the sensor element. It mediates the conflict by allowing electromagnetic signals to pass through while physically blocking encapsulation material from reaching the fragile mechanical structures.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Adaptability or versatility

If the sensor element is exposed to the outer environment, then pressure sensing is enabled, but the fragile mechanical structures are vulnerable to damage

Engineering Contradiction:

Improvepressure sensing capabilityVSAvoidmechanical integrity

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

Different parts of the device have different properties: the opening area allows environmental exposure for pressure sensing, while the wall structure provides mechanical protection. The sensor element itself has localized fragile structures that require protection, while other areas remain exposed for functionality.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The wall structure functions as a protective shell or barrier that separates the fragile internal mechanical structures from the external environment. This thin film-like structure allows pressure transmission while providing mechanical protection against damage.

Inventive Principle:

Principle #30Flexible shells and thin films

3Ease of operation

If an opening is provided in the substrate for signal passage, then connectivity is achieved, but encapsulation material can enter the sensitive areas

Engineering Contradiction:

Improvesignal connectivityVSAvoidprotection from encapsulation material

Core Design Contradiction:

Ease of operationVSReliability

Solution Approach 1:

The solution moves from a two-dimensional opening problem to a three-dimensional structure by adding vertical walls. The opening allows signal passage in the horizontal plane, while the walls provide vertical containment of encapsulation material, effectively using the third dimension to resolve the contradiction.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10155657B2Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening

Publication Date: 2018.12.18 INFINEON TECHNOLOGIES AG

AI summary

The electronic device comprises a semiconductor chip comprising a first main face, a second main face opposite to the first main face, side faces connecting the first and second main faces, and a sensor element or actuator element disposed at the first main face, and a substrate, wherein the semiconductor chip is disposed above the substrate, the first main face of the semiconductor chip facing the substrate, wherein the substrate comprises a substrate opening, the substrate opening permitting passage of signals to the sensor element or from the actuator element.