3D IC Packaging with Substrate Cavity and Bottom Flip Chip
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Solution Overview
Problem
Current electronics packaging technologies face challenges in accommodating high-speed devices exceeding one TeraHertz, with limitations in cooling, reliability, cost, and complexity, leading to increased production risks and costs, while struggling to meet the demands of next-generation portable electronics that require smaller footprints, higher density, and lower power consumption.
Innovation Solution
The method involves a substrate with a cavity for mounting a bottom flip chip die below and an internal integrated circuit die above, filling the gaps with a substance, and encapsulating the internal die, which reduces process time, package height, and enhances structural rigidity, using film-assisted molding for protection and automation in manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If current packaging technologies are used for high-speed devices exceeding one TeraHertz, then device functionality is achieved, but cooling and reliability concerns worsen
Solution Approach 1:
The packaging system is divided into multiple functional layers including a substrate, a first integrated circuit die mounted on the substrate, and a second integrated circuit die mounted on the substrate. This segmentation allows for distributed thermal management and improved reliability by separating functional components across different spatial zones, addressing the cooling and reliability concerns associated with high-speed operation.
Solution Approach 2:
The patent transitions from traditional planar packaging to a three-dimensional stacked architecture where the first and second integrated circuit dies are mounted on the substrate in different spatial arrangements. This dimensional change enables improved heat dissipation pathways and enhanced cooling efficiency while maintaining high-speed device performance.
2Manufacturing precision
If automation is implemented to achieve acceptable yield in ultra miniature form factors, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The substrate is prepared with pre-defined mounting locations and electrical interconnect structures before the integrated circuit dies are mounted. This preliminary action simplifies the subsequent assembly process, enabling automated placement and reducing manufacturing complexity while maintaining high precision and acceptable yield in ultra miniature form factors.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, thermal management pathways, and structural framework for the stacked die architecture. This multi-functionality reduces the need for additional specialized components, thereby simplifying the overall manufacturing process while achieving high manufacturing precision.
3Area of moving object
If next generation packaging is designed for smaller footprints and higher density, then area is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent implements a stacked die architecture where the first and second integrated circuit dies are vertically arranged on the substrate, creating a nested three-dimensional structure. This nesting approach achieves smaller package footprint and higher component density by utilizing vertical space, while the modular stacked design actually simplifies manufacturing compared to planar alternatives.
Solution Approach 2:
The packaging system transitions from two-dimensional planar layout to three-dimensional stacked configuration, arranging integrated circuit dies in vertical layers on the substrate. This dimensional change dramatically reduces package footprint and increases component density while the standardized stacking process simplifies automated manufacturing.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate having a substrate cavity; mounting a bottom flip chip die below the substrate; mounting an internal integrated circuit die above the substrate; filling between the internal integrated circuit die and the substrate and between the bottom flip chip die and the substrate with a substance filling through the substrate cavity; and encapsulating the internal integrated circuit die with an encapsulation.