Flip Chip Substrate With Segmented Conductive Traces
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Solution Overview
Problem
Conventional flip chip bonding structures do not allow for the flexibility to change connected circuits once the chip and substrate are manufactured and bonded, limiting their application to different products and increasing manufacturing costs.
Innovation Solution
A substrate with optional circuits and a flip chip bonding structure that includes conductive traces with breaking areas, allowing for the connection of different circuits by using bumps to connect either open or closed conductive traces, enabling the selection of appropriate circuits for various products.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional flip chip bonding structure is used, then the connection between chip and substrate is stable and reliable, but the connected circuit is fixed and cannot be changed
Solution Approach 1:
The conductive trace is divided into multiple segments with breaking areas between them. The breaking areas allow the trace to be selectively interrupted, enabling different circuit configurations. This segmentation resolves the contradiction by maintaining structural integrity while enabling post-bonding circuit selection.
Solution Approach 2:
The conductive trace structure transitions from a static, fixed circuit connection to a dynamic, selectable circuit configuration. The breaking areas enable the circuit to be reconfigured after bonding by selectively removing or maintaining continuity at specific points, providing adaptability while maintaining reliability.
2Adaptability or versatility
If multiple types of substrates or chips are manufactured to connect different circuits, then different circuit connections are achieved, but the manufacturing cost increases
Solution Approach 1:
A single substrate or chip design incorporates multiple conductive traces with breaking areas, enabling it to connect to different circuits universally. This multi-functional design eliminates the need for manufacturing multiple specialized substrate or chip types, thereby reducing manufacturing costs while maintaining circuit connection flexibility.
Solution Approach 2:
The circuit configuration is changed by modifying the continuity parameter of the conductive traces at the breaking areas rather than changing the physical substrate or chip itself. This parameter-based reconfiguration allows different circuit connections from a single manufactured component, reducing manufacturing complexity and cost.
3Ease of manufacture
If conductive traces without breaking areas are used, then the manufacturing process is simple, but the circuit connection is fixed and cannot be adjusted post-bonding
Solution Approach 1:
The conductive trace is segmented into multiple sections with breaking areas, allowing selective interruption while maintaining overall manufacturing simplicity. The breaking areas are designed to be easily removable or adjustable, providing post-bonding circuit adjustment capability without significantly complicating the manufacturing process.
Data Source
AI summary
The present invention relates to a substrate having optional circuits and a structure of flip chip bonding. The substrate includes a substrate body, at least one substrate pad, a first conductive trace and a second conductive trace. The substrate body has a surface. The substrate pad is disposed on the surface of the substrate body. The first conductive trace is connected to a first circuit, and has a first breaking area so it forms a discontinuous line. The second conductive trace is connected to a second circuit, and has a second breaking area so tit forms a discontinuous line. The second conductive trace and the first conductive trace are connected to the same substrate pad. Thus, the substrate can choose to connect different circuits, so the substrate can be applied to different products by connecting the desired circuit, thus reducing the manufacturing cost.