Flip-Chip Substrate Strengthening Structure for Warpage Control
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Solution Overview
Problem
Traditional flip-chip package substrates suffer from insufficient rigidity leading to warpage during high-temperature packaging, which results in poor connections and electrical failures, and increasing the core layer thickness to address this issue complicates manufacturing, increases costs, and hinders fine pitch and line spacing in circuit designs.
Innovation Solution
A flip-chip package substrate with a strengthening structure comprising a rigid layer made of conductive or insulating materials bonded onto the circuit structure, which enhances rigidity without the need for a thick core layer, allowing for compact designs and improved heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the core layer is increased to improve rigidity and reduce warpage, then the rigidity of the substrate is improved, but the manufacturing complexity increases, production cost increases, and fine pitch between conductive through holes becomes harder to achieve
Solution Approach 1:
The patent introduces a strengthening structure that extends laterally beyond the core layer boundaries, providing rigidity enhancement in a different dimensional approach rather than simply increasing core layer thickness. This lateral extension allows the substrate to gain structural support without proportionally increasing overall thickness, thereby maintaining manufacturability and fine pitch capabilities while improving rigidity.
Solution Approach 2:
The strengthening structure is formed as a composite component comprising multiple materials including solder resist material and conductive materials, creating a multi-functional layer that provides both structural reinforcement and electrical functionality. This composite approach allows rigidity enhancement without requiring a uniform increase in core layer thickness throughout the entire substrate.
2Stability of the object's composition
If the thickness of the core layer is increased to reduce warpage, then warpage is reduced, but the intervals between conductive through holes cannot be effectively minimized, hindering fine pitch designs
Solution Approach 1:
The strengthening structure extends laterally beyond the core layer boundaries, providing rigidity enhancement in a different dimensional approach rather than simply increasing core layer thickness. This lateral extension allows the substrate to gain structural support without proportionally increasing overall thickness, thereby maintaining manufacturability and fine pitch capabilities while improving rigidity.
Solution Approach 2:
The strengthening structure is selectively positioned and configured to provide rigidity enhancement specifically in regions where warpage is most problematic, rather than uniformly increasing thickness across the entire substrate. This localized reinforcement maintains fine pitch capabilities in critical areas while providing warpage control where needed.
3Strength
If the thickness of the core layer is increased to improve rigidity, then the rigidity is improved, but the overall thickness of the substrate increases, which is unfavorable to compact packaging designs and increases production cost
Solution Approach 1:
The strengthening structure extends laterally beyond the core layer boundaries, providing rigidity enhancement in a different dimensional approach rather than simply increasing core layer thickness. This lateral extension allows the substrate to gain structural support without proportionally increasing overall thickness, thereby maintaining manufacturability and fine pitch capabilities while improving rigidity.
Solution Approach 2:
The strengthening structure functions as a thin, laterally-extending reinforcement layer that provides significant rigidity enhancement without adding substantial thickness. This thin-film approach allows the substrate to maintain a compact profile suitable for modern packaging requirements while gaining the necessary structural strength.
4Strength
If the thickness of the core layer is increased, then rigidity is improved, but heat dissipation becomes poorer and electrical performance deteriorates due to longer conductive paths
Solution Approach 1:
The strengthening structure extends laterally beyond the core layer boundaries, providing rigidity enhancement in a different dimensional approach rather than simply increasing core layer thickness. This lateral extension allows the substrate to gain structural support without proportionally increasing overall thickness, thereby maintaining manufacturability and fine pitch capabilities while improving rigidity.
Solution Approach 2:
The strengthening structure is separated from the core layer as a distinct, independently-formed component rather than being integrated into the core layer itself. This separation allows the core layer to maintain its original thin profile for optimal heat dissipation and electrical performance, while the strengthening structure provides the necessary rigidity support without interfering with thermal and electrical pathways.
Data Source
AI summary
A flip-chip package substrate is provided. A strengthening structure is provided on one side of a circuit structure to increase the rigidity of the flip-chip package substrate. When the flip-chip package substrate is used in large-scale packaging, the flip-chip package substrate can have good rigidity, so that the electronic package can be prevented from warping.