Flip-Chip Electrode Terminal Layout for Uniform Bonding Strength
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Solution Overview
Problem
Existing semiconductor devices with flip-chip bonding face challenges in maintaining consistent bonding strength and reducing electrical resistance due to variations in electrode terminal heights, leading to potential incline mounting and decreased connection strength.
Innovation Solution
The semiconductor device incorporates a configuration where the number of second electrode terminals per unit area is lower than first electrode terminals, with larger areas and specific shapes to reduce height variations, and optionally includes dummy terminals to adjust current density and simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of electrode terminals per unit area is increased, then the electrical connection capability is improved, but the height variations between terminals increase leading to inconsistent bonding strength
Solution Approach 1:
The patent applies local quality by differentiating the design parameters of first electrode terminals and second electrode terminals. First electrode terminals have smaller areas and are arranged with higher density, while second electrode terminals have larger areas and are arranged with lower density. This localized differentiation allows each terminal type to be optimized for its specific function, reducing height variations and improving bonding consistency.
Solution Approach 2:
The patent changes geometric parameters of electrode terminals to control their heights. By adjusting the area and shape parameters of second electrode terminals to be larger than first electrode terminals, the invention compensates for height variations through parameter optimization, ensuring consistent bonding strength across all terminals.
2Manufacturing precision
If electrode terminals with uniform heights are used, then bonding strength consistency is improved, but the electrical resistance and connection reliability deteriorate due to insufficient current distribution
Solution Approach 1:
The patent implements local quality by assigning different areas and densities to first and second electrode terminals. This localized differentiation enables both terminals to maintain appropriate heights while second electrode terminals with larger areas provide enhanced current distribution capability, ensuring both height uniformity and electrical connection reliability.
Solution Approach 2:
The patent optimizes geometric parameters of electrode terminals, specifically making second electrode terminals larger in area to reduce height variations while maintaining sufficient current distribution. This parameter optimization resolves the contradiction between height uniformity and electrical connection reliability.
3Reliability
If complex electrode terminal arrangements are used, then the electrical connection capability is improved, but the manufacturing complexity and difficulty increase
Solution Approach 1:
The patent applies segmentation by dividing electrode terminals into two distinct types: first electrode terminals with smaller areas and higher density, and second electrode terminals with larger areas and lower density. This segmentation simplifies the manufacturing process by creating clear design categories that are easier to fabricate while maintaining enhanced electrical connection capability through the combined arrangement of both terminal types.
Data Source
AI summary
A semiconductor element includes: an element front surface and an element back surface facing an opposite side from the element front surface; first and second electrodes that are formed over the element front surface; first electrode terminals in contact with the first electrode; second electrode terminals in contact with the second electrode; a first region in which the first electrode terminals are arranged; and a second region in which the second electrode terminals are arranged, wherein the number of the second electrode terminals per unit area in the second region is smaller than the number of the first electrode terminals per unit area in the first region, and wherein an area of each of the second electrode terminals is larger than an area of each of the first electrode terminals when viewed from a thickness direction which is perpendicular to the element front surface.