Flip Chip Thermal Collection Layer for Heat Dissipation
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Solution Overview
Problem
Flip chip packages face challenges in thermal performance improvement due to their small size and limited space in electronic devices, making it difficult to attach heat sinks for cooling.
Innovation Solution
A thermal collection layer with high thermal conductivity materials, such as copper, is attached to the surface of flip chip dies opposite the mounting surface, providing efficient heat dissipation and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is attached to the flip chip package to improve thermal performance, then heat dissipation is enhanced, but the package size increases and space requirements are exceeded
Solution Approach 1:
The thermal collection layer is integrated within the package structure itself, nested between the flip chip die and substrate, rather than adding an external heat sink. This nested approach allows thermal management functionality to be embedded within the existing package volume, improving heat dissipation without increasing overall package size.
Solution Approach 2:
The invention transitions from external thermal management (heat sinks attached to the package exterior) to internal thermal management by incorporating a thermal collection layer within the package structure. This dimensional shift from external to internal thermal management enables heat dissipation functionality without increasing package footprint or volume.
2Volume of moving object
If the package size is reduced for portable devices, then space efficiency is improved, but thermal performance deteriorates
Solution Approach 1:
The thermal collection layer is applied locally to the specific region where heat generation occurs (the flip chip die area), concentrating thermal management resources where most needed. This localized approach provides effective thermal performance in a compact area, enabling small package size without sacrificing thermal management capability.
Solution Approach 2:
The thermal collection layer acts as an intermediary between the heat-generating flip chip die and the substrate, providing a dedicated thermal conduction path. This intermediary layer efficiently transfers heat away from the die in a compact configuration, maintaining thermal performance despite reduced package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal dissipation and reduces the need for heat sinks, enabling smaller package sizes while maintaining high power functionality and conserving power, especially in portable electronic devices.
Implementation Method 1
A thermal collection layer is mounted on, formed on, or attached to the second surface of the flip chip die, the thermal collection layer configured to dissipate heat generated by the flip chip die
Data Source
AI summary
Methods for improving thermal performance, such as thermal dissipation, of flip chip packages that include one or more flip chip dies are disclosed. In some embodiments, a thermal collection layer can be formed on a surface of a flip chip die. The thermal collection layer can be configured to dissipate heat generated by the flip chip die. In some variations, the thermal collection layer can be constructed using materials having high thermal conductivity.