FLIP Chip Package Thermal Path Design for Heat Dissipation
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Solution Overview
Problem
High-performance semiconductor chips face challenges with heat dissipation in smaller form factors, leading to increased temperatures that can impact performance and reliability.
Innovation Solution
A semiconductor package with integrated thermal dissipation features, including a substrate with vias filled with thermal conductive materials and a pyrolytic graphite sheet covered by thermal conductive materials, forming heat dissipation paths to transfer heat from integrated circuits to a metal layer without increasing size or sacrificing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If higher performance is achieved with faster circuits, then processing speed and performance are improved, but power consumption increases and temperatures rise
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional thermal management by stacking multiple thermal dissipation layers (first and second thermal dissipation layers with different orientations) and utilizing vertical heat conduction paths through the substrate, thereby dissipating heat in multiple spatial dimensions to effectively reduce operating temperatures while maintaining high processing speeds
Solution Approach 2:
The patent employs composite thermal dissipation structures combining substrate materials with integrated thermal dissipation layers having different thermal conductivities and orientations. The first thermal dissipation layer conducts heat in a first direction while the second thermal dissipation layer conducts heat in a second direction, creating a composite thermal management system that efficiently dissipates heat generated by high-performance circuits
2Temperature
If thermal dissipation features are added to reduce temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent merges thermal dissipation functions directly into the substrate structure by integrating first and second thermal dissipation layers within the substrate itself. This integration approach combines multiple thermal management functions into a unified structure, achieving effective temperature control without proportionally increasing device complexity
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: it provides mechanical support, electrical connectivity, and integrated thermal dissipation through the embedded first and second thermal dissipation layers. This multi-functionality reduces the need for separate thermal management components, thereby controlling device complexity while achieving effective temperature management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces operating temperatures of semiconductor packages by four degrees Centigrade or more, maintaining performance and density while improving thermal dissipation without enlarging the package size.
Implementation Method 1
A substrate of the semiconductor package includes one or more vias that are filled with a thermal conductive material such as, for example, copper or silver. A pyrolytic graphite sheet (PGS) or other thermal conductive material is provided on a top surface of the substrate next to the integrated circuit. The pyrolytic graphite sheet connects the metal layer and the thermal conductive material overlaying the integrated circuit to form various thermal dissipation paths. As such, any heat generated by the integrated circuit can be transferred from the integrated circuit to the vias and the metal layer via the pyrolytic graphite sheet.
Data Source
AI summary
A semiconductor package having various thermal dissipation features to dissipate heat. The semiconductor package may include an integrated circuit and a non-volatile storage device. Vias may be formed in the substrate and filled with a thermal conductive material. A pyrolytic graphite sheet overlays a top surface of the substrate and the vias. The pyrolytic graphite sheet defines one or more openings that enable the integrated circuit and the non-volatile storage device to be coupled to the top surface of the substrate. The integrated circuit is covered by another thermal conductive material such as a copper or silver paste. The copper or silver paste also covers a sidewall of the pyrolytic graphite sheet. The semiconductor package is enclosed by molding material and a metal layer. The pyrolytic graphite sheet connects the metal layer and the thermal conductive material overlaying the integrated circuit to form various thermal dissipation paths.